Articles in Scholarly Journals [Incomplete List]

1. Low-temperature sol–gel intermediate layer wafer bonding
   Thin Solid Films, vol. 496, no. 2, pp. 560–565, 2006
2. Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects
   Thin Solid Films, vol. 504, no. 1-2, pp. 288–293, 2006
3. Investigation of weight-on-wheel switch failure in F-16 aircraft
   Engineering Failure Analysis, vol. 12, no. 4, pp. 508–519, 2005