Ching Ping Wong

Personal Home Page

http://www.mse.gatech.edu/FacultyStaff/MSE_Faculty_researchbios/Wong/wong.html

Articles in Scholarly Journals [Incomplete List]

  1. Solid-state spun fibers and yarns from 1-mm long carbon nanotube forests synthesized by water-assisted chemical vapor deposition
    Journal of Materials Science, vol. 43, no. 13, pp. 4356–4362, 2008
  2. Polymer transcrystallinity induced by carbon nanotubes
    Polymer, vol. 49, no. 5, pp. 1356–1364, 2008
  3. Enhancing the Electrical and Optoelectronic Performance of Nanobelt Devices by Molecular Surface Functionalization
    Nano Letters, vol. 7, no. 5, pp. 1323–1328, 2007
  4. Hierarchical Silicon Etched Structures for Controlled Hydrophobicity/Superhydrophobicity
    Nano Letters, vol. 7, no. 11, pp. 3388–3393, 2007
  5. High dielectric constant polyaniline/epoxy composites via in situ polymerization for embedded capacitor applications
    Polymer, vol. 48, no. 6, pp. 1510–1516, 2007
  6. High Performance Nonconductive Film with Ï?-Conjugated Self-Assembled Molecular Wires for Fine Pitch Interconnect Applications
    Journal of Electronic Materials, vol. 36, no. 5, pp. 549–554, 2007
  7. Magnetic Nanocomposite for Potential Ultrahigh Frequency Microelectronic Application
    Journal of Electronic Materials, vol. 36, no. 5, pp. 593–597, 2007
  8. Oxidation Prevention and Electrical Property Enhancement of Copper-Filled Isotropically Conductive Adhesives
    Journal of Electronic Materials, vol. 36, no. 10, pp. 1341–1347, 2007
  9. Ferrite Polymer Composite for Improving the Electromagnetic Compatibility of Semiconductor Packaging
    Journal of Electronic Materials, vol. 36, no. 12, pp. 1711–1718, 2007
  10. Effects of IL-4 on cyclooxygenase-2 and platelet-derived growth factor in the lungs of COPD rats
    Journal of Nanjing Medical University, vol. 21, no. 3, pp. 169–174, 2007
  11. The growth of carbon nanotube stacks in the kinetics-controlled regime
    Carbon, vol. 45, no. 2, pp. 344–348, 2007
  12. The preparation of stable metal nanoparticles on carbon nanotubes whose surfaces were modified during production
    Carbon, vol. 45, no. 3, pp. 655–661, 2007
  13. Characterization and properties of an organic–inorganic dielectric nanocomposite for embedded decoupling capacitor applications
    Composites Part A: Applied Science and Manufacturing, vol. 38, no. 1, pp. 13–19, 2007
  14. Synthesis and Thermal and Wetting Properties of Tin/Silver Alloy Nanoparticles for Low Melting Point Lead-Free Solders
    Chemistry of Materials, vol. 19, no. 18, pp. 4482–4485, 2007
  15. Tin/Indium nanobundle formation from aggregation or growth of nanoparticles
    Journal of Nanoparticle Research, vol. 10, no. 1, pp. 41–46, 2007
  16. Preparation, thermal and mechanical properties of POSS epoxy hybrid composites
    Journal of Applied Polymer Science, vol. 104, no. 4, pp. 2113–2121, 2007
  17. Low temperature carbon nanotube film transfer via conductive polymer composites
    Nanotechnology, vol. 18, no. 12, p. 125203, 2007
  18. Investigation of electrical contact resistance for nonconductive film functionalized with p-conjugated self-assembled molecules
    Applied Physics Letters, vol. 90, no. 9, p. 092102, 2007
  19. Optimization of Epoxy-Barium Titanate Nanocomposites for High Performance Embedded Capacitor Components
    IEEE Transactions on Components and Packaging Technologies, vol. 30, no. 2, pp. 248–253, 2007
  20. IEEE Transactions on Components and Packaging Technologies, vol. 29, no. 1, pp. 173–178, 2006
  21. IEEE Transactions on Components and Packaging Technologies, vol. 29, no. 1, pp. 190–197, 2006
  22. A Novel Aluminum-Filled Composite Dielectric for Embedded Passive Applications
    IEEE Transactions on Advanced Packaging, vol. 29, no. 2, pp. 295–306, 2006
  23. Microwave assisted patterning of vertically aligned carbon nanotubes onto polymer substrates
    Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, vol. 24, no. 4, p. 1947, 2006
  24. Enhancement of Electrical Properties of Electrically Conductive Adhesives (ECAs) by Using Novel Aldehydes
    IEEE Transactions on Components and Packaging Technologies, vol. 29, no. 4, pp. 758–763, 2006
  25. Nano Letters, vol. 6, no. 2, pp. 243–247, 2006
  26. Journal of Physical Chemistry B, vol. 110, no. 32, pp. 15945–15950, 2006
  27. High dielectric constant SU8 composite photoresist for embedded capacitors
    Journal of Applied Polymer Science, vol. 103, no. 3, pp. 1523–1528, 2006
  28. Effect of the polymer matrices on the dielectric behavior of a percolative high-k polymer composite for embedded capacitor applications
    Journal of Electronic Materials, vol. 35, no. 5, pp. 1087–1094, 2006
  29. Novel, environmentally friendly crosslinking system of an epoxy using an amino acid: Tryptophan-cured diglycidyl ether of bisphenol A epoxy
    Journal of Polymer Science Part A: Polymer Chemistry, vol. 45, no. 2, pp. 181–190, 2006
  30. A rapid growth of aligned carbon nanotube films and high-aspect-ratio arrays
    Journal of Electronic Materials, vol. 35, no. 2, pp. 195–199, 2006
  31. High dielectric constant polymer-ceramic (Epoxy varnish-barium titanate) nanocomposites at moderate filler loadings for embedded capacitors
    Journal of Electronic Materials, vol. 35, no. 11, pp. 2009–2015, 2006
  32. Interaction of railway vehicles with track in cross-winds
    Journal of Fluids and Structures, vol. 22, no. 3, pp. 295–314, 2006
  33. Mechanical and radiographic properties of a shape memory polymer composite for intracranial aneurysm coils
    Materials Science and Engineering: C, vol. 26, no. 8, pp. 1373–1379, 2006
  34. Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications
    Materials Science and Engineering: R: Reports, vol. 51, no. 1-3, pp. 1–35, 2006
  35. The Journal of Physical Chemistry B, vol. 110, no. 11, pp. 5445–5449, 2006
  36. Journal of Physical Chemistry B, vol. 110, no. 25, pp. 12289–12292, 2006
  37. Growth and electrical characterization of high-aspect-ratio carbon nanotube arrays
    Carbon, vol. 44, no. 2, pp. 253–258, 2006
  38. Size-dependent melting properties of tin nanoparticles
    Chemical Physics Letters, vol. 429, no. 4-6, pp. 492–496, 2006
  39. Variable Frequency Microwave Synthesis of Silver Nanoparticles
    Journal of Nanoparticle Research, vol. 8, no. 1, pp. 117–124, 2006
  40. Chemistry of Materials, vol. 18, no. 13, pp. 2969–2973, 2006
  41. Langmuir, vol. 22, no. 23, pp. 9676–9681, 2006
  42. Synthesis and dielectric properties of novel high-K polymer composites containing in-situ formed silver nanoparticles for embedded capacitor applications
    Journal of Materials Chemistry, vol. 16, no. 16, p. 1543, 2006
  43. Monolayer protection for eletrochemical migration control in silver nanocomposite
    Applied Physics Letters, vol. 89, no. 11, p. 112112, 2006
  44. High performance anisotropic conductive adhesives for lead-free interconnects
    Soldering & Surface Mount Technology, vol. 18, no. 2, pp. 33–39, 2006
  45. Study on mono-dispersed nano-size silica by surface modification for underfill applications
    Journal of Colloid and Interface Science, vol. 292, no. 2, pp. 436–444, 2005
  46. MEAM molecular dynamics study of lead free solder for electronic packaging applications
    Modelling and Simulation in Materials Science and Engineering, vol. 13, no. 8, pp. 1279–1290, 2005
  47. Influence of interphase and moisture on the dielectric spectroscopy of epoxy/silica composites
    Polymer, vol. 46, no. 7, pp. 2297–2305, 2005
  48. Rheology Study of Wafer Level Underfill
    Macromolecular Materials and Engineering, vol. 290, no. 12, pp. 1204–1212, 2005
  49. Study on the Gelation of a No-Flow Underfill Through Monte Carlo Simulation
    Macromolecular Chemistry and Physics, vol. 206, no. 8, pp. 869–877, 2005
  50. Novel curing agent for lead-free electronics: Amino acid
    Journal of Polymer Science Part A: Polymer Chemistry, vol. 44, no. 2, pp. 1020–1027, 2005
  51. Enhancement of electrical properties of anisotropically conductive adhesive joints via low temperature sintering
    Journal of Applied Polymer Science, vol. 99, no. 4, pp. 1665–1673, 2005
  52. Nano Letters, vol. 5, no. 12, pp. 2641–2645, 2005
  53. Low-loss percolative dielectric composite
    Applied Physics Letters, vol. 87, no. 8, p. 082907, 2005
  54. MATERIALS SCIENCE: Electronics Without Lead
    Science, vol. 308, no. 5727, pp. 1419–1420, 2005
  55. Reliability improvement of conductive adhesives on tin (Sn) surfaces
    Journal of Adhesion Science and Technology , vol. 19, no. 16, pp. 1427–1444, 2005
  56. Industry Updates
    Journal of Failure Analysis & Prevention, vol. 5, no. 4, pp. 31–37, 2005
  57. Molecular dynamics study of a nano-particle joint for potential lead-free anisotropic conductive adhesives applications
    Journal of Adhesion Science and Technology, vol. 19, no. 2, pp. 87–94, 2005
  58. Processing and shape effects on silver paste electrically conductive adhesives (ECAs)
    Journal of Adhesion Science and Technology, vol. 19, no. 7, pp. 565–578, 2005
  59. Adhesion Improvement of Thermoplastic Isotropically Conductive Adhesive
    IEEE Transactions on Components and Packaging Technologies, vol. 28, no. 2, pp. 327–336, 2005
  60. Influence of Temperature and Humidity on Adhesion of Underfills for Flip Chip Packaging
    IEEE Transactions on Components and Packaging Technologies, vol. 28, no. 1, pp. 88–94, 2005
  61. Modeling of the Curing Kinetics of No-Flow Underfill in Flip-Chip Applications
    IEEE Transactions on Components and Packaging Technologies, vol. 27, no. 2, pp. 383–390, 2004
  62. Moisture Absorption in Uncured Underfill Materials
    IEEE Transactions on Components and Packaging Technologies, vol. 27, no. 2, pp. 345–351, 2004
  63. A Reworkable Epoxy Resin for Isotropically Conductive Adhesive
    IEEE Transactions on Advanced Packaging, vol. 27, no. 1, pp. 165–172, 2004
  64. Novel Reworkable Fluxing Underfill for Board-Level Assembly
    IEEE Transactions on Advanced Packaging, vol. 27, no. 3, pp. 525–532, 2004
  65. Recent Advances in Flip-Chip Underfill: Materials, Process, and Reliability
    IEEE Transactions on Advanced Packaging, vol. 27, no. 3, pp. 515–524, 2004
  66. Next Generation of 100-<tex>$murm m$</tex>-Pitch Wafer-Level Packaging and Assembly for Systems-on-Package
    IEEE Transactions on Advanced Packaging, vol. 27, no. 2, pp. 413–425, 2004
  67. Development of a high curing latency no-flow underfill with self-fluxing ability for lead-free solder interconnects
    Journal of Adhesion Science and Technology, vol. 18, no. 1, pp. 109–121, 2004
  68. The role of water in delamination in electronic packages: degradation of interfacial adhesion
    Journal of Adhesion Science and Technology, vol. 18, no. 10, pp. 1103–1121, 2004
  69. Study on B-stage properties of wafer level underfills
    Journal of Adhesion Science and Technology, vol. 18, no. 3, pp. 361–380, 2004
  70. FEM modeling of temperature distribution of a flip-chip no-flow underfill package during solder reflow process
    IEEE Transactions on Electronics Packaging Manufacturing, vol. 27, no. 1, pp. 86–93, 2004
  71. Adhesion improvement of thermoplastic-based isotropic conductive adhesives under humid environment using self-assembled monolayer compounds
    Journal of Adhesion Science and Technology, vol. 18, no. 2, pp. 153–167, 2004
  72. Adhesion between an underfill and the passivation layer in flip-chip packaging
    Journal of Adhesion Science and Technology, vol. 18, no. 2, pp. 275–285, 2004
  73. Development of a novel polymer-metal nanocomposite obtained through the route ofin situ reduction for integral capacitor application
    Journal of Applied Polymer Science, vol. 93, no. 4, pp. 1531–1538, 2004
  74. An electrical approach to monitor wire and cable thermal oxidation aging condition based on carbon black filled conductive polymer composite
    Journal of Applied Polymer Science, vol. 93, no. 2, pp. 513–520, 2004
  75. Material characterization of a high-dielectric-constant polymer-ceramic composite for embedded capacitor for RF applications
    Journal of Applied Polymer Science, vol. 92, no. 4, pp. 2228–2231, 2004
  76. Glass transition and relaxation behavior of epoxy nanocomposites
    Journal of Polymer Science Part B: Polymer Physics, vol. 42, no. 21, pp. 3849–3858, 2004
  77. Anisotropy of gas permeability associated with cleat pattern in a coal seam of the Kushiro coalfield in Japan
    Environmental Geology, vol. 47, no. 1, pp. 45–50, 2004
  78. A novel approach to stabilize contact resistance of electrically conductive adhesives on lead-free alloy surfaces
    Journal of Electronic Materials, vol. 33, no. 2, pp. 106–113, 2004
  79. Electrical approach to monitor the thermal oxidation aging of carbon black filled ethylene propylene rubber
    Polymer Degradation and Stability, vol. 86, no. 2, pp. 209–215, 2004
  80. Wafer bonding using microwave heating of parylene intermediate layers
    Journal of Micromechanics and Microengineering, vol. 14, no. 4, pp. 625–631, 2004
  81. A study of impact performance of conductive adhesives
    International Journal of Adhesion and Adhesives, vol. 24, no. 5, pp. 449–453, 2004
  82. Study on the Curing Process and the Gelation of Epoxy/Anhydride System for No-Flow Underfill for Flip-Chip Applications
    Macromolecular Materials and Engineering, vol. 288, no. 4, pp. 365–371, 2003
  83. Di-block copolymer surfactant study to optimize filler dispersion in high dielectric constant polymer-ceramic composite
    Composites Part A: Applied Science and Manufacturing, vol. 34, no. 11, pp. 1113–1116, 2003
  84. Enhancement of antifillet cracking performance for no-flow underfill by toughening method
    Journal of Applied Polymer Science, vol. 88, no. 10, pp. 2439–2449, 2003
  85. Development of new no-flow underfill materials for both eutectic Sn-Pb solder and a high temperature melting lead-free solder
    IEEE Transactions on Components and Packaging Technologies, vol. 26, no. 2, pp. 466–472, 2003
  86. Improved stability of contact resistance of low melting point alloy incorporated isotropically conductive adhesives
    IEEE Transactions on Components and Packaging Technologies, vol. 26, no. 2, pp. 375–381, 2003
  87. Improvement of adhesion and electrical properties of reworkable thermoplastic conductive adhesives
    Journal of Adhesion Science and Technology, vol. 17, no. 13, pp. 1785–1799, 2003
  88. Adhesion evaluation on low-cost alternatives to thermosetting epoxy encapsulants
    IEEE Transactions on Electronics Packaging Manufacturing, vol. 26, no. 2, pp. 173–178, 2003
  89. Surface property of passivation layer on integrated circuit chip and solder mask layer on printed circuit board
    IEEE Transactions on Electronics Packaging Manufacturing, vol. 26, no. 4, pp. 345–351, 2003
  90. Double-layer no-flow underfill materials and process
    IEEE Transactions on Advanced Packaging, vol. 26, no. 2, pp. 199–205, 2003
  91. An improvement of thermal conductivity of underfill materials for flip-chip packages
    IEEE Transactions on Advanced Packaging, vol. 26, no. 1, pp. 25–32, 2003
  92. Study on underfill/solder adhesion in flip-chip encapsulation
    IEEE Transactions on Advanced Packaging, vol. 25, no. 4, pp. 473–480, 2002
  93. Development of high performance interfill materials for system chips technology
    IEEE Transactions on Components and Packaging Technologies, vol. 25, no. 2, pp. 217–223, 2002
  94. Assembly of lead-free bumped flip-chip with no-flow underfills
    IEEE Transactions on Electronics Packaging Manufacturing, vol. 25, no. 2, pp. 113–119, 2002
  95. Development of new low stress epoxies for MEMS device encapsulation
    IEEE Transactions on Components and Packaging Technologies, vol. 25, no. 2, pp. 278–282, 2002
  96. Adhesion of underfill and components in flip chip encapsulation
    Journal of Adhesion Science and Technology, vol. 16, no. 2, pp. 213–223, 2002
  97. Combined effects of silica filler and its interface in epoxy resin
    Acta Materialia, vol. 50, no. 17, pp. 4369–4377, 2002
  98. Material Characterization of High Dielectric Constant Polymer-Ceramic Composite for Embedded capacitor to RF Application
    Active and Passive Electronic Components, vol. 25, no. 1, pp. 123–129, 2002
  99. Development of reworkable underfill from hybrid composite of free radical polymerization system and epoxy resin
    IEEE Transactions on Components and Packaging Technologies, vol. 25, no. 1, pp. 148–155, 2002
  100. Effective elastic modulus of underfill material for flip-chip applications
    IEEE Transactions on Components and Packaging Technologies, vol. 25, no. 1, pp. 53–55, 2002
  101. Development of environmentally friendly nonanhydride no-flow underfills
    IEEE Transactions on Components and Packaging Technologies, vol. 25, no. 1, pp. 140–147, 2002
  102. Study on the catalytic behavior of metal acetylacetonates for epoxy curing reactions
    Journal of Applied Polymer Science, vol. 86, no. 7, pp. 1572–1579, 2002
  103. Study on mobility of water and polymer chain in epoxy and its influence on adhesion
    Journal of Applied Polymer Science, vol. 85, no. 1, pp. 1–8, 2002
  104. Syntheses and characterizations of thermally degradable epoxy resins. III
    Journal of Polymer Science Part A: Polymer Chemistry, vol. 40, no. 11, pp. 1796–1807, 2002
  105. Cure kinetics modeling and process optimization of the vialux 81 epoxy photodielectric dry film (PDDF) material for microvia applications
    Journal of Applied Polymer Science, vol. 84, no. 4, pp. 691–700, 2002
  106. Study of additive-epoxy interaction of thermally reworkable underfills
    Journal of Applied Polymer Science, vol. 81, no. 8, pp. 1868–1880, 2001
  107. Novel polymer-ceramic nanocomposite based on high dielectric constant epoxy formula for embedded capacitor application
    Journal of Applied Polymer Science, vol. 83, no. 5, pp. 1084–1090, 2001
  108. Study on effect of coupling agents on underfill material in flip chip packaging
    IEEE Transactions on Components and Packaging Technologies, vol. 24, no. 1, pp. 38–42, 2001
  109. Effect of UV/ozone treatment on surface tension and adhesion in electronic packaging
    IEEE Transactions on Components and Packaging Technologies, vol. 24, no. 1, pp. 43–49, 2001
  110. Development of no-flow underfill materials for lead-free solder bumped flip-chip applications
    IEEE Transactions on Components and Packaging Technologies, vol. 24, no. 1, pp. 59–66, 2001
  111. Thermal and mechanical characterization of ViaLUX/sup TM/ 81: a novel epoxy photo-dielectric dry film (PDDF) for microvia applications
    IEEE Transactions on Components and Packaging Technologies, vol. 24, no. 3, pp. 436–444, 2001
  112. Reworkable no-flow underfills for flip chip applications
    IEEE Transactions on Electronics Packaging Manufacturing, vol. 24, no. 2, pp. 115–122, 2001
  113. Journal of Electronics Manufacturing, vol. 10, no. 3, p. 191, 2000
  114. MICROELECTRONICS: Flip the Chip
    Science, vol. 290, no. 5500, pp. 2269–2270, 2000
  115. Journal of Electronics Manufacturing, vol. 10, no. 2, p. 97, 2000
  116. New Reworkable High Temperature Low Modulus (in Excess of 400–500?°C) Adhesives for MCM-D Assembly
    Journal of Electronic Packaging, vol. 122, no. 1, p. 55, 2000
  117. Isotropic conductive adhesives filled with low-melting-point alloy fillers
    IEEE Transactions on Electronics Packaging Manufacturing, vol. 23, no. 3, pp. 185–190, 2000
  118. A precise numerical prediction of effective dielectric constant for polymer-ceramic composite based on effective-medium theory
    IEEE Transactions on Components and Packaging Technologies, vol. 23, no. 4, pp. 680–683, 2000
  119. Development of conductive adhesives for solder replacement
    IEEE Transactions on Components and Packaging Technologies, vol. 23, no. 4, pp. 620–626, 2000
  120. An improved methodology for determining temperature dependent moduli of underfill encapsulants
    IEEE Transactions on Components and Packaging Technologies, vol. 23, no. 3, pp. 434–439, 2000
  121. A study of contact resistance of conductive adhesives based on anhydride-cured epoxy systems
    IEEE Transactions on Components and Packaging Technologies, vol. 23, no. 3, pp. 440–446, 2000
  122. Study on effect of carbon black on behavior of conductive polymer composites with positive temperature coefficient
    IEEE Transactions on Components and Packaging Technologies, vol. 23, no. 1, pp. 151–156, 2000
  123. Syntheses and characterizations of thermally reworkable epoxy resins II
    Journal of Polymer Science Part A: Polymer Chemistry, vol. 38, no. 20, pp. 3771–3782, 2000
  124. Investigation of the curing behavior of a novel epoxy photo-dielectric dry film (ViaLux? 81) for high density interconnect applications
    Journal of Applied Polymer Science, vol. 78, no. 2, pp. 430–437, 2000
  125. Effects of shrinkage on conductivity of isotropic conductive adhesives
    International Journal of Adhesion and Adhesives, vol. 20, no. 3, pp. 189–193, 2000
  126. Journal of Thermal Analysis and Calorimetry, vol. 61, no. 1, pp. 3–12, 2000
  127. Underfill adhesion to BCB (Cyclotene/sup TM/) bumping and redistribution dielectrics
    IEEE Transactions on Advanced Packaging, vol. 23, no. 3, pp. 568–573, 2000
  128. Journal of Thermal Analysis and Calorimetry, vol. 59, no. 3, pp. 729–740, 2000
  129. Evaluation and characterization of reliable non-hermetic conformal coatings for microelectromechanical system (MEMS) device encapsulation
    IEEE Transactions on Advanced Packaging, vol. 23, no. 4, pp. 721–728, 2000
  130. Enhancement of underfill encapsulants for flip-chip technology
    Soldering & Surface Mount Technology, vol. 11, no. 3, pp. 33–39, 1999
  131. Novel high performance no flow and reworkable underfills for flip-chip applications
    Materials Research Innovations, vol. 2, no. 4, pp. 232–247, 1999
  132. Syntheses and characterizations of thermally reworkable epoxy resins. Part I
    Journal of Polymer Science Part A: Polymer Chemistry, vol. 37, no. 15, pp. 2991–3001, 1999
  133. Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging
    Journal of Applied Polymer Science, vol. 74, no. 14, pp. 3396–3403, 1999
  134. Novel conductive adhesives for surface mount applications
    Journal of Applied Polymer Science, vol. 74, no. 2, pp. 399–406, 1999
  135. Characterization of reworkable high-temperature adhesives for MCM-D application
    Journal of Applied Polymer Science, vol. 73, no. 6, pp. 997–1005, 1999
  136. Effects of the complexed moisture in metal acetylacetonate on the properties of the no-flow underfill materials
    Journal of Applied Polymer Science, vol. 73, no. 1, pp. 103–111, 1999
  137. A study of lubricants on silver flakes for microelectronics conductive adhesives
    IEEE Transactions on Components and Packaging Technologies, vol. 22, no. 3, pp. 365–371, 1999
  138. Novel thermally reworkable underfill encapsulants for flip-chip applications
    IEEE Transactions on Advanced Packaging, vol. 22, no. 1, pp. 46–53, 1999
  139. Comparative study of thermally conductive fillers for use in liquid encapsulants for electronic packaging
    IEEE Transactions on Advanced Packaging, vol. 22, no. 1, pp. 54–59, 1999
  140. Correlation of flip chip underfill process parameters and material properties with in-process stress generation
    IEEE Transactions on Electronics Packaging Manufacturing, vol. 22, no. 1, pp. 53–62, 1999
  141. Recent advances in plastic packaging of flip-chip and multichip modules (MCM) of microelectronics
    IEEE Transactions on Components and Packaging Technologies, vol. 22, no. 1, pp. 21–25, 1999
  142. Study of the fluxing agent effects on the properties of no-flow underfill materials for flip-chip applications
    IEEE Transactions on Components and Packaging Technologies, vol. 22, no. 2, pp. 141–151, 1999
  143. Novel bi-layer conformal coating for reliability without hermeticity MEMS encapsulation
    IEEE Transactions on Electronics Packaging Manufacturing, vol. 22, no. 3, pp. 195–201, 1999
  144. Conductivity mechanisms of isotropic conductive adhesives (ICAs)
    IEEE Transactions on Electronics Packaging Manufacturing, vol. 22, no. 3, pp. 223–227, 1999
  145. Mechanisms underlying the unstable contact resistance of conductive adhesives
    IEEE Transactions on Electronics Packaging Manufacturing, vol. 22, no. 3, pp. 228–232, 1999
  146. Do chip size limits exist for DCA?
    IEEE Transactions on Electronics Packaging Manufacturing, vol. 22, no. 4, pp. 255–263, 1999
  147. Characterization of underfill/substrate interfacial toughness enhancement by silane additives
    IEEE Transactions on Electronics Packaging Manufacturing, vol. 22, no. 4, pp. 264–267, 1999
  148. Study on the relationship between the surface composition of copper pads and no-flow underfill fluxing capability
    IEEE Transactions on Electronics Packaging Manufacturing, vol. 22, no. 4, pp. 268–273, 1999
  149. Development of the wafer level compressive-flow underfill process and its involved materials
    IEEE Transactions on Electronics Packaging Manufacturing, vol. 22, no. 4, pp. 274–281, 1999
  150. Studies of latent catalyst systems for pot-life enhancement of flip chip underfills
    IEEE Transactions on Electronics Packaging Manufacturing, vol. 22, no. 4, pp. 282–289, 1999
  151. High performance conductive adhesives
    IEEE Transactions on Electronics Packaging Manufacturing, vol. 22, no. 4, pp. 324–330, 1999
  152. Recent advances in the development of no-flow underfill encapsulants-a practical approach towards the actual manufacturing application
    IEEE Transactions on Electronics Packaging Manufacturing, vol. 22, no. 4, pp. 331–339, 1999
  153. High-temperature, low-modulus adhesive attach for large-area thin-film processing on silicon and alumina tiles
    IEEE Transactions on Electronics Packaging Manufacturing, vol. 22, no. 4, pp. 290–294, 1999
  154. Separation of low molecular siloxanes for electronic application by liquid-liquid extraction
    IEEE Transactions on Electronics Packaging Manufacturing, vol. 22, no. 4, pp. 295–298, 1999
  155. Journal of Electronics Manufacturing, vol. 9, no. 3, p. 223, 1999
  156. Journal of Electronics Manufacturing, vol. 9, no. 4, p. 241, 1999
  157. Abstracts
    IEEE Transactions on Electronics Packaging Manufacturing, vol. 22, no. 3, pp. 182–184, 1999
  158. Abstracts
    IEEE Transactions on Electronics Packaging Manufacturing, vol. 22, no. 4, pp. 249–252, 1999
  159. High performance no-flow underfills for low-cost flip-chip applications: material characterization
    IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, vol. 21, no. 3, pp. 450–458, 1998
  160. Fast-flow underfill encapsulant: flow rate and coefficient of thermal expansion
    IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, vol. 21, no. 2, pp. 360–364, 1998
  161. Nonhermetic plastic packaging of high voltage electronic switches utilizing a low-stress glob coating for 95/5Pb/Sn solder joints of flip-chip bonded multichip module high voltage devices
    IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C, vol. 21, no. 1, pp. 34–40, 1998
  162. Use of compliant adhesives in the large area processing of MCM-D substrates
    IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C, vol. 21, no. 4, pp. 311–316, 1998
  163. Preencapsulation cleaning methods and control for microelectronics packaging
    IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, vol. 17, no. 4, pp. 542–552, 1994
  164. Robust titanate-modified encapsulants for high voltage potting application of multichip module/hybrid IC
    IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 16, no. 8, pp. 868–875, 1993
  165. Encapsulant for nonhermetic multichip packaging applications
    IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 15, no. 4, pp. 510–518, 1992