William R. Eisenstadt

Personal Home Page

http://www.tec.ufl.edu/~wre/

Articles in Scholarly Journals [Incomplete List]

  1. IEEE Design & Test of Computers, vol. 25, no. 2, pp. 160–166, 2008
  2. IEEE Transactions on Microwave Theory and Techniques, vol. 56, no. 5, pp. 1193–1200, 2008
  3. IEEE Transactions on Microwave Theory and Techniques, vol. 56, no. 5, pp. 1207–1214, 2008
  4. IEEE Transactions on Microwave Theory and Techniques, vol. 56, no. 6, pp. 1485–1492, 2008
  5. IEEE Transactions on Microwave Theory and Techniques, vol. 56, no. 7, pp. 1555–1564, 2008
  6. IEEE Transactions on Microwave Theory and Techniques, vol. 56, no. 8, pp. 1790–1796, 2008
  7. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 25, no. 5, pp. 909–913, 2006
  8. Bipolar Microwave RMS Power Detectors
    IEEE Journal of Solid-State Circuits, vol. 41, no. 9, pp. 2188–2192, 2006
  9. Embedded Loopback Test for RF ICs
    IEEE Transactions on Instrumentation and Measurement, vol. 54, no. 5, pp. 1715–1720, 2005
  10. A Translinear RMS Detector for Embedded Test Of RF ICs
    IEEE Transactions on Instrumentation and Measurement, vol. 54, no. 5, pp. 1708–1714, 2005
  11. IEEE Transactions on Microwave Theory and Techniques, vol. 53, no. 4, pp. 1197–1202, 2005
  12. Differential Log-Domain Filters With High-Gain Common-Mode Feedback
    IEEE Transactions on Circuits and Systems I: Fundamental Theory and Applications, vol. 51, no. 2, pp. 254–263, 2004
  13. Analytical Models and Algorithms for the Efficient Signal Integrity Verification of Inductance-Effect-Prominent Multicoupled VLSI Circuit Interconnects
    IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 12, no. 4, pp. 395–407, 2004
  14. A Decoupling Technique for Efficient Timing Analysis of VLSI Interconnects With Dynamic Circuit Switching
    IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 23, no. 9, pp. 1321–1337, 2004
  15. A compact multilayer IC package model for efficient simulation, analysis, and design of high-performance VLSI circuits
    IEEE Transactions on Advanced Packaging, vol. 26, no. 4, pp. 392–401, 2003
  16. A traveling-wave-based waveform approximation technique for the timing verification of single transmission lines
    IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 21, no. 6, pp. 723–730, 2002
  17. Generalized traveling-wave-based waveform approximation technique for the efficient signal integrity verification of multicoupled transmission line system
    IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 21, no. 12, pp. 1489–1497, 2002
  18. Circuit for monitoring BJT RF performance using DC measurements
    IEEE Journal of Solid-State Circuits, vol. 2, no. 9, pp. 1207–1210, 2002
  19. Fast and accurate quasi-three-dimensional capacitance determination of multilayer VLSI interconnects
    IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 9, no. 3, pp. 450–460, 2001
  20. Analog Integrated Circuits and Signal Processing, vol. 28, no. 1, pp. 73–82, 2001
  21. A new on-chip interconnect crosstalk model and experimental verification for CMOS VLSI circuit design
    IEEE Transactions on Electron Devices, vol. 47, no. 1, pp. 129–140, 2000
  22. Improvement in electrical and dielectric behavior of (Ba,Sr)TiO_{3} thin films by Ag doping
    Physical Review B, vol. 61, no. 11, pp. 7305–7307, 2000
  23. Direct measurement of crosstalk between integrated differential circuits
    IEEE Transactions on Microwave Theory and Techniques, vol. 48, no. 8, pp. 1410–1413, 2000
  24. LINC power amplifier combiner method efficiency optimization
    IEEE Transactions on Vehicular Technology, vol. 49, no. 1, pp. 229–234, 2000
  25. New simultaneous switching noise analysis and modeling for high-speed and high-density CMOS IC package design
    IEEE Transactions on Advanced Packaging, vol. 23, no. 2, pp. 303–312, 2000
  26. S-parameter-measurement-based high-speed signal transient characterization of VLSI interconnects on SiO/sub 2/-Si substrate
    IEEE Transactions on Advanced Packaging, vol. 23, no. 3, pp. 470–479, 2000
  27. Accuracy estimation of mixed-mode scattering parameter measurements
    IEEE Transactions on Microwave Theory and Techniques, vol. 47, no. 1, pp. 102–105, 1999
  28. Calibration and verification of the pure-mode vector network analyzer
    IEEE Transactions on Microwave Theory and Techniques, vol. 46, no. 7, pp. 1009–1012, 1998
  29. Pure-mode network analyzer for on-wafer measurements of mixed-mode S-parameters of differential circuits
    IEEE Transactions on Microwave Theory and Techniques, vol. 45, no. 7, pp. 1071–1077, 1997
  30. Substrate parasitics and dual-resistivity substrates [microwave integrated circuits]
    IEEE Transactions on Microwave Theory and Techniques, vol. 44, no. 7, pp. 1170–1174, 1996
  31. Combined differential and common-mode analysis of power splitters and combiners
    IEEE Transactions on Microwave Theory and Techniques, vol. 43, no. 11, pp. 2627–2632, 1995
  32. Generalized coupled interconnect transfer function and high-speed signal simulations
    IEEE Transactions on Microwave Theory and Techniques, vol. 43, no. 5, pp. 1115–1121, 1995
  33. Combined differential and common-mode scattering parameters: theory and simulation
    IEEE Transactions on Microwave Theory and Techniques, vol. 43, no. 7, pp. 1530–1539, 1995
  34. Simulations and measurements of picosecond signal transients, propagation, and crosstalk on lossy VLSI interconnect
    IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, vol. 18, no. 1, pp. 215–225, 1995
  35. High-speed VLSI interconnect modeling based on S-parameter measurements
    IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 16, no. 5, pp. 555–562, 1993
  36. S-parameter-based IC interconnect transmission line characterization
    IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 15, no. 4, pp. 483–490, 1992
  37. Modelling of coupled interconnect lines for integrated circuits
    International Journal of Electronics, vol. 70, no. 4, pp. 751–764, 1991
  38. A novel lossy and dispersive interconnect model for integrated circuit simulation
    IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 13, no. 2, pp. 275–280, 1990
  39. CMOS VLSI single event transient characterization
    IEEE Transactions on Nuclear Science, vol. 36, no. 6, pp. 2287–2291, 1989
  40. Optoelectronic measurements of picosecond electrical pulse propagation in coplanar waveguide transmission lines
    IEEE Transactions on Microwave Theory and Techniques, vol. 37, no. 10, pp. 1612–1619, 1989
  41. Circuit modeling of collector current spreading effects in quasi-saturation for advanced bipolar transistors
    Solid-State Electronics, vol. 31, no. 12, pp. 1725–1731, 1988
  42. A physics-based current-dependent base resistance mode; for advanced bipolar transistors
    IEEE Transactions on Electron Devices, vol. 35, no. 7, pp. 1055–1062, 1988
  43. S-parameter measurement prediction for bipolar transistors using a physical device simulator
    IEEE Transactions on Electron Devices, vol. 35, no. 10, pp. 1633–1639, 1988
  44. SPICE Simulation of SOI MOSFET Integrated Circuits
    IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 5, no. 4, pp. 653–658, 1986
  45. On-Chip Picosecond Time-Domain Measurements for VLSI and Interconnect Testing Using Photoconductors
    IEEE Journal of Solid-State Circuits, vol. 20, no. 1, pp. 284–289, 1985
  46. Integrated picosecond photoconductors produced on bulk Si substrates
    Applied Physics Letters, vol. 45, no. 4, p. 404, 1984
  47. IEEE Transactions on Electron Devices, vol. 29, no. 4, pp. 669–675, 1982