Wei Huang works on architecture and system design for large-scale systems with considerations of physical constraints such as energy, power delivery, temperature, and reliability, from chips to data centers. He received a Ph.D. degree in electrical engineering from University of Virginia. His dissertation resulted in HotSpot, a chip, and package level thermal simulator, for computer architecture and VLSI research. He received the Best Paper Award at IGCC 2011, awards from SRC System-on-Chip Design Challenge in 2005-2006 (First Place in Phase I, Second Place in Phase II), and the Best Student Paper award at ISCA in 2003. He received his B.S. degree from the University of Science and Technology of China.
Biography Updated on 29 December 2011