Articles in Scholarly Journals [Incomplete List]

1. Reactive wetting of Sn0.7Cu–xZn lead-free solders on Cu substrate
   Journal of Alloys and Compounds, vol. 433, no. 1-2, pp. 302–305, 2007
2. Sn concentration on the reactive wetting of high-Pb solder on Cu substrate
   Materials Chemistry and Physics, vol. 99, no. 2-3, pp. 202–205, 2006
3. Morphology and growth pattern transition of intermetallic compounds between Cu and Sn-3.5Ag containing a small amount of additives
   Journal of Electronic Materials, vol. 35, no. 12, pp. 2081–2087, 2006
4. Effects of addition participation in the interfacial reaction on the growth patterns of Cu6Sn5-based IMCs during reflow process
   Journal of Alloys and Compounds, vol. 421, no. 1-2, pp. 283–288, 2006
5. Mechanical properties evolution of Sn-3.5Ag based lead-free solders by nanoindentation
   Materials Letters, vol. 60, no. 19, pp. 2315–2318, 2006
6. Effects of Co and Ni addition on reactive diffusion between Sn–3.5Ag solder and Cu during soldering and annealing
   Materials Science and Engineering: A, vol. 420, no. 1-2, pp. 39–46, 2006
7. Reactive wetting of solders on Cu and Cu6Sn5/Cu3Sn/Cu substrates using wetting balance
   Scripta Materialia, vol. 55, no. 9, pp. 823–826, 2006
8. Formation of microlayers of clad residue on aluminium brazing sheet during melting and resolidification in brazing process
   Materials Science and Technology, vol. 20, no. 5, pp. 577–584, 2004
9. Micromechanical properties of heterogeneous aluminum?silicon brazed joint
   Materials Letters, vol. 58, no. 22-23, pp. 2861–2866, 2004
10. Residual clad formation and aluminum brazed joint topology prediction
    Materials Letters, vol. 57, no. 29, pp. 4592–4596, 2003
11. Microstructure development and metallurgical analysis of the Al–Si contact reaction
    Journal of Materials Processing Technology, vol. 122, no. 2-3, pp. 305–308, 2002