Tong Hong Wang0000-0001-5580-3845
Tong Hong Wang received the Ph.D. degree in engineering science in 2008, and M.S. and B.S. degrees in 2002 and 2000, respectively, in aeronautics and astronautics engineering from National Cheng Kung University (NCKU), Tainan, Taiwan. He works currently as a Deputy Technical Manager with Group R&D, Advanced Semiconductor Engineering (ASE), Inc., where he is assisting Central Product Solutions with substrate technologies, thermal and stress-reliability issues, material characterizations of electronic packaging components, and project management and orientation. He was previously in charge of stress-reliability tests and thermal characterizations of electronic packages with 12 engineers and technicians under his supervision. He also led stress and thermal simulation team for the service of computer-aided engineering based on finite element and finite volume analyses. He is the holder of 27 Taiwan patents and 2 U.S. patents, along with over 80 technical publications in the field of electronic packaging. He was selected as Outstanding Young Engineer by Chinese Society of Mechanical Engineers in 2008. He is a Member of Chinese Institute of Engineers, Chinese Society of Mechanical Engineers of Taiwan, and IMAPS.
Biography Updated on 25 November 2010