Yu-Ting Cheng was born in Taiwan, China. He received the B.S. and M.S. degrees in materials science and engineering from the National Tsing Hua University, Hsinchu, Taiwan, in 1991 and 1993, respectively, the M.S. degree in materials science and engineering from Carnegie Mellon University, Pittsburgh, PA, in 1996, and the Ph.D. degree in electrical engineering from the University of Michigan, Ann Arbor, in 2000. He has been working with the army service in Taiwan for two years. His Ph.D. thesis is focused on the development of novel vacuum packaging technique for microelectromechanical system (MEMS) applications. After finishing his Ph.D. study in 2000, he became a Research Staff Member at the IBM Thomas J. Watson Research Center, Yorktown Heights, where he was involved in several system-on-a-package (SoP) projects. In 2002, he joined the Department of Electronics Engineering, National Chiao Tung University, Hsinchu, Taiwan, as an Assistant Professor and has been a Professor since 2009. Currently, he serves at the same university as the Director of Continuing Education Center and Vice-Provost of Academic Affairs. His research interests include the fundamental study of materials for microsystem integration and nano-/MEMS applications, SoP, and the design and fabrication of microsensors and microactuators. He was a corecipient of the 2006 Best Paper Award presented at the 13th IEEE International Conference on Electronics, Circuits and Systems. He has been serving as a TPC Member of IEEE NEMS since 2011 and APCOT 2012. He serves as a Member of IOP, and Phi Tau Phi.
Biography Updated on 29 December 2011