Jung Seung Boo

Articles in Scholarly Journals [Incomplete List]

  1. Effect of plasma treatment on adhesion characteristics at interfaces between underfill and substrate
    International Journal of Adhesion and Adhesives, vol. 27, no. 3, pp. 200–206, 2007
  2. Design of Solder Joint Structure for Flip Chip Package with an Optimized Shear Test Method
    Journal of Electronic Materials, vol. 36, no. 6, pp. 690–696, 2007
  3. Solid-state interfacial reactions between Sn–3.5Ag–0.7Cu solder and electroless Ni-immersion Au substrate during high temperature storage test
    Journal of Alloys and Compounds, vol. 439, no. 1-2, pp. 91–96, 2007
  4. Dynamic t–Tdyn–Tg diagram analysis of thermal isomerization of polyisoimide using complex electric modulus properties
    Polymer, vol. 48, no. 11, pp. 3248–3255, 2007
  5. Microstructural evolution of Sn-rich Au–Sn/Ni flip-chip solder joints under high temperature storage testing conditions
    Scripta Materialia, vol. 56, no. 8, pp. 661–664, 2007
  6. Effects of heat treatment and film thickness on microstructure and critical properties of YBCO film processed by TFA-MOD
    Physica C: Superconductivity, vol. 451, no. 2, pp. 118–126, 2007
  7. Effect of bonding force on the reliability of the flip chip packages employing anisotropic conductive film with reflow process
    Materials Science and Engineering: A, vol. 452-453, pp. 267–272, 2007
  8. Effect of surface finish of substrate on mechanical reliability of In-48Sn solder joints in MOEMS package
    Microsystem Technologies, vol. 13, no. 11-12, pp. 1567–1573, 2007
  9. Reliability analysis of Au?Sn flip-chip solder bump fabricated by co-electroplating
    Journal of Materials Research, vol. 22, no. 5, pp. 1219–1229, 2007
  10. Solder joint reliability evaluation of Sn–Zn/Au/Ni/Cu ball-grid-array package during aging
    Materials Science and Engineering: A, vol. 452-453, pp. 46–54, 2007
  11. Characterization of Failure Behaviors in Anisotropic Conductive Interconnection
    MATERIALS TRANSACTIONS, vol. 48, no. 5, pp. 1070–1078, 2007
  12. Evaluation of Joint Resistance Between Bi-2223/Ag Superconducting Tapes
    IEEE Transactions on Applied Superconductivity, vol. 16, no. 2, pp. 1059–1062, 2006
  13. Interfacial reactions and shear strength on Cu and electrolytic Au/Ni metallization with Sn-Zn solder
    Journal of Materials Research, vol. 21, no. 6, pp. 1590–1599, 2006
  14. Interfacial reactions and joint strength of Sn?37Pb and Sn?3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 �C
    Journal of Materials Research, vol. 21, no. 12, pp. 3196–3204, 2006
  15. Two Different Phases of a Conducting Polymer Film Formed by Electrocasting Method
    Molecular Crystals and Liquid Crystals, vol. 445, no. 1, pp. 9/[299]–16/[306], 2006
  16. Investigations of the test parameters and bump structures in the shear test of flip chip solder bump
    Thin Solid Films, vol. 504, no. 1-2, pp. 405–409, 2006
  17. Evaluation of solder joint reliability in flip chip package under thermal shock test
    Thin Solid Films, vol. 504, no. 1-2, pp. 426–430, 2006
  18. Interfacial reaction in steel–aluminum joints made by friction stir welding
    Scripta Materialia, vol. 55, no. 4, pp. 355–358, 2006
  19. Reliability studies of Snâ??9Zn/Cu solder joints with aging treatment
    Journal of Alloys and Compounds, vol. 407, no. 1-2, pp. 141–149, 2006
  20. Effect of isothermal aging on the interfacial reactions between Snâ??0.4Cu solder and Cu substrate with or without ENIG plating layer
    Surface and Coatings Technology, vol. 200, no. 14-15, pp. 4440–4447, 2006
  21. Effects of electromigration on microstructural evolution of eutectic SnPb flip chip solder bumps
    Microelectronic Engineering, vol. 83, no. 11-12, pp. 2391–2395, 2006
  22. High temperature reliability and interfacial reaction of eutectic Snâ??0.7Cu/Ni solder joints during isothermal aging
    Microelectronics and Reliability, vol. 46, no. 5-6, pp. 905–914, 2006
  23. Evaluation of displacement rate effect in shear test of Snâ??3Agâ??0.5Cu solder bump for flip chip application
    Microelectronics and Reliability, vol. 46, no. 2-4, pp. 535–542, 2006
  24. Development of textured Ni substrates prepared by powder metallurgy and casting
    Physica C: Superconductivity, vol. 436, no. 2, pp. 103–109, 2006
  25. Fabrication of YBCO coated conductor by TFA-MOD using the “211 process”
    Physica C: Superconductivity, vol. 445-448, pp. 594–597, 2006
  26. Interfacial reaction of ENIG/Sn-Ag-Cu/ENIG sandwich solder joint during isothermal aging
    Microelectronic Engineering, vol. 83, no. 11-12, pp. 2329–2334, 2006
  27. Au–Sn flip-chip solder bump for microelectronic and optoelectronic applications
    Microsystem Technologies, vol. 13, no. 11-12, pp. 1463–1469, 2006
  28. Effects of bonding pressure on the thermo-mechanical reliability of ACF interconnection
    Microelectronic Engineering, vol. 83, no. 11-12, pp. 2335–2340, 2006
  29. Effects of reflow and cooling conditions on interfacial reaction and IMC morphology of Snâ??Cu/Ni solder joint
    Journal of Alloys and Compounds, vol. 415, no. 1-2, pp. 56–61, 2006
  30. Investigation of interfacial reaction and joint reliability between eutectic Sn–3.5Ag solder and ENIG-plated Cu substrate during high temperature storage test
    Journal of Materials Science: Materials in Electronics, vol. 18, no. 5, pp. 559–567, 2006
  31. Characteristic analysis of electroless Ni plating layer for electronic packaging
    Surface and Interface Analysis, vol. 38, no. 4, pp. 440–443, 2006
  32. Interfacial reactions between In–48Sn solder and electroless nickel/immersion gold substrate during reflow process
    Surface and Interface Analysis, vol. 38, no. 4, pp. 426–428, 2006
  33. Effects of Cr3C2 on the microstructure and mechanical properties of the brazed joints between WCâ??Co and carbon steel
    International Journal of Refractory Metals and Hard Materials, vol. 24, no. 3, pp. 215–221, 2006
  34. Microstructures and wear property of friction stir welded AZ91 Mg/SiC particle reinforced composite
    Composites Science and Technology, vol. 66, no. 11-12, pp. 1513–1520, 2006
  35. Effects of number of reflows on the mechanical and electrical properties of BGA package
    Intermetallics, vol. 14, no. 10-11, pp. 1375–1378, 2006
  36. Reexamination of the solder ball shear test for evaluation of the mechanical joint strength
    International Journal of Solids and Structures, vol. 43, no. 7-8, pp. 1928–1945, 2006
  37. Interfacial reactions and joint reliability of Snâ??9Zn solder on Cu or electrolytic Au/Ni/Cu BGA substrate
    Microelectronic Engineering, vol. 82, no. 3-4, pp. 561–568, 2005
  38. Effect of substrate metallization on mechanical properties of Snâ??3.5Ag BGA solder joints with multiple reflows
    Microelectronic Engineering, vol. 82, no. 3-4, pp. 569–574, 2005
  39. Reliability evaluations of flip chip package under thermal shock test
    Microelectronic Engineering, vol. 82, no. 3-4, pp. 575–580, 2005
  40. Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing
    Journal of Alloys and Compounds, vol. 390, no. 1-2, pp. 212–219, 2005
  41. Solid state interfacial reaction and joint strength of Snâ??37Pb solder with Niâ??P under bump metallization in flip chip application
    Journal of Alloys and Compounds, vol. 395, no. 1-2, pp. 80–87, 2005
  42. Optimization of shear test for flip chip solder bump using 3-dimensional computer simulation
    Microelectronic Engineering, vol. 82, no. 3-4, pp. 554–560, 2005
  43. Interfacial reactions between Snâ??0.4Cu solder and Cu substrate with or without ENIG plating layer during reflow reaction
    Journal of Alloys and Compounds, vol. 396, no. 1-2, pp. 122–127, 2005
  44. Correlation between the interfacial reaction and mechanical joint strength of the flip chip solder bump during isothermal aging
    Journal of Materials Science: Materials in Electronics, vol. 16, no. 9, pp. 603–609, 2005
  45. Solid state intermetallic compound layer growth between Sn-8Zn-3Bi solder and bare copper substrate
    Journal of Materials Science: Materials in Electronics, vol. 16, no. 8, pp. 523–528, 2005
  46. Characterization of the shear test method with low melting point In?48Sn solder joints
    Materials Science and Engineering A, vol. 397, no. 1-2, pp. 145–152, 2005
  47. Interfacial reactions and growth kinetics for intermetallic compound layer between In?48Sn solder and bare Cu substrate
    Journal of Alloys and Compounds, vol. 386, no. 1-2, pp. 151–156, 2005
  48. Fabrication of YBCO coated conductor by TFA-MOD method in route of dissolving Y211 and BaCuO powders in TFA
    Physica C: Superconductivity, vol. 426-431, pp. 973–978, 2005
  49. Microstructural investigation of friction stir welded pure titanium
    Materials Letters, vol. 59, no. 26, pp. 3315–3318, 2005
  50. Effect of aging conditions on interfacial reaction and mechanical joint strength between Snâ??3.0Agâ??0.5Cu solder and Niâ??P UBM
    Materials Science and Engineering B, vol. 121, no. 3, pp. 204–210, 2005
  51. Interfacial reaction and mechanical properties of eutectic Sn?0.7Cu/Ni BGA solder joints during isothermal long-term aging
    Journal of Alloys and Compounds, vol. 391, no. 1-2, pp. 82–89, 2005
  52. IMC morphology, interfacial reaction and joint reliability of Pb-free Sn?Ag?Cu solder on electrolytic Ni BGA substrate
    Journal of Alloys and Compounds, vol. 392, no. 1-2, pp. 247–252, 2005
  53. Kinetics of intermetallic compound layer growth and interfacial reactions between Sn–8Zn–5In solder and bare copper substrate
    Materials Science and Technology, vol. 21, no. 3, pp. 381–386, 2005
  54. Correlation between displacement rate and shear force in shear test of Sn–Pb and lead free solder joints
    Materials Science and Technology, vol. 21, no. 3, pp. 373–380, 2005
  55. Intermetallic Compound Formation and Growth Kinetics in Flip Chip Joints Using Sn–3.0Ag–0.5Cu Solder and Ni–P under Bump Metallurgy
    MATERIALS TRANSACTIONS, vol. 46, no. 6, pp. 1295–1300, 2005
  56. Microstructure and Mechanical Properties of Sn–0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method
    MATERIALS TRANSACTIONS, vol. 46, no. 11, pp. 2366–2371, 2005
  57. Interfacial Reaction and Mechanical Characterization of Eutectic Sn–Zn/ENIG Solder Joints during Reflow and Aging
    MATERIALS TRANSACTIONS, vol. 46, no. 11, pp. 2386–2393, 2005
  58. Induction Brazing of .GAMMA.-TiAl to Alloy Steel AISI 4140 Using Filler Metal of Eutectic Ag-Cu Alloy Coated with Ti Film
    MATERIALS TRANSACTIONS, vol. 46, no. 2, pp. 303–308, 2005
  59. Mechanical Properties Related to Microstructural Variation of 6061 Al Alloy Joints by Friction Stir Welding
    MATERIALS TRANSACTIONS, vol. 45, no. 5, pp. 1700–1705, 2004
  60. Effect of Microstructure on Mechanical Properties of Friction-Welded Joints between Ti and AISI 321 Stainless Steel
    MATERIALS TRANSACTIONS, vol. 45, no. 9, pp. 2805–2811, 2004
  61. IMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During Aging
    MATERIALS TRANSACTIONS, vol. 45, no. 3, pp. 727–733, 2004
  62. Effect of bonding time on joint properties of vacuum brazed WC – Co hard metal/carbon steel using stacked Cu and Ni alloy as insert metal
    Materials Science and Technology, vol. 20, no. 11, pp. 1474–1478, 2004
  63. Friction welding of TiAl and AISI4140
    Journal of Materials Science, vol. 39, no. 3, pp. 1125–1128, 2004
  64. Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate
    Journal of Materials Science, vol. 39, no. 13, pp. 4211–4217, 2004
  65. Interfacial reactions and intermetallic compound growth between indium and copper
    Journal of Materials Science: Materials in Electronics, vol. 15, no. 2, pp. 95–98, 2004
  66. Experimental and finite element analysis of the shear speed effects on the Sn–Ag and Sn–Ag–Cu BGA solder joints
    Materials Science and Engineering A, vol. 371, no. 1-2, pp. 267–276, 2004
  67. Effects of copper insert layer on the properties of friction welded joints between TiAl and AISI 4140 structural steel
    Intermetallics, vol. 12, no. 6, pp. 671–678, 2004
  68. The joint properties of copper by friction stir welding
    Materials Letters, vol. 58, no. 6, pp. 1041–1046, 2004
  69. Effect of Al and catalyst thicknesses on the growth of carbon nanotubes and application to gated field emitter arrays
    Chemical Physics Letters, vol. 400, no. 1-3, pp. 139–144, 2004
  70. Effect of reflow time on interfacial reaction and shear strength of Sn–0.7Cu solder/Cu and electroless Ni–P BGA joints
    Journal of Alloys and Compounds, vol. 385, no. 1-2, pp. 192–198, 2004
  71. Intermetallic compound layer growth at the interface between Sn?Cu?Ni solder and Cu substrate
    Journal of Alloys and Compounds, vol. 381, no. 1-2, pp. 151–157, 2004
  72. Growth kinetics of Ni3Sn4 and Ni3P layer between Sn?3.5Ag solder and electroless Ni?P substrate
    Journal of Alloys and Compounds, vol. 376, no. 1-2, pp. 105–110, 2004
  73. Phase analysis and kinetics of solid-state ageing of Pb-free Sn?3.5Ag solder on electroless Ni?P substrate
    Surface and Interface Analysis, vol. 36, no. 8, pp. 963–965, 2004
  74. The effect of isothermal aging on the thickness of intermetallic compound layer growth between low melting point solders and Ni-plated Cu substrate
    Journal of Electronic Materials, vol. 33, no. 12, pp. 1561–1566, 2004
  75. Journal of Materials Science, vol. 38, no. 20, pp. 4183–4191, 2003
  76. The improvement of mechanical properties of friction-stir-welded A356 Al alloy
    Materials Science and Engineering A, vol. 355, no. 1-2, pp. 154–159, 2003
  77. Effects of fine fiber structures on the mechanical and electrical properties of cold rolled Cu-Ag sheet
    Journal of Materials Science Letters, vol. 22, no. 24, pp. 1751–1754, 2003
  78. Investigation of interfacial reactions between Sn–5Bi solder and Cu substrate
    Journal of Alloys and Compounds, vol. 359, no. 1-2, pp. 202–208, 2003
  79. Journal of Materials Science: Materials in Electronics, vol. 14, no. 8, pp. 487–493, 2003
  80. Journal of Materials Science, vol. 38, no. 6, pp. 1281–1287, 2003
  81. The joint properties of dissimilar formed Al alloys by friction stir welding according to the fixed location of materials
    Scripta Materialia, vol. 49, no. 5, pp. 423–428, 2003
  82. An HDI Polyisocyanate Aerosol Exposure System for Large-Scale Animal Experiments
    AIHA Journal, vol. 64, no. 4, pp. 439–444, 2003
  83. Evaluation of the microstructure and mechanical properties of friction stir welded 6005 aluminum alloy
    Materials Science and Technology, vol. 19, no. 11, pp. 1513–1518, 2003
  84. Joint properties of friction stir welded AZ31B– H24 magnesium alloy
    Materials Science and Technology, vol. 19, no. 6, pp. 785–790, 2003
  85. Effect of friction welding parameters on mechanical and metallurgical properties of aluminium alloy 5052–A36 steel joint
    Materials Science and Technology, vol. 19, no. 6, pp. 773–778, 2003
  86. Activation energies of intermetallic compound growth at interface between Sn–5Bi–3.5Ag solder and Cu substrate
    Materials Science and Technology, vol. 19, no. 8, pp. 1101–1106, 2003
  87. Reaction Diffusion and Formation of Cu11In9 and In27Ni10 Phases in the Couple of Indium-Substrates.
    MATERIALS TRANSACTIONS, vol. 44, no. 1, pp. 72–77, 2003
  88. The Joint Characteristics of Friction Stir Welded AZ91D Magnesium Alloy
    MATERIALS TRANSACTIONS, vol. 44, no. 5, pp. 917–923, 2003
  89. Lead-Free Electronics Packaging. Effect of Isothermal Aging on Ball Shear Strength in BGA Joints with Sn-3.5Ag-0.75Cu Solder.
    MATERIALS TRANSACTIONS, vol. 43, no. 8, pp. 1858–1863, 2002
  90. Effect of Surface Finishes on Ball Shear Strength in BGA Joints with Sn-3.5 mass%Ag Solder.
    MATERIALS TRANSACTIONS, vol. 43, no. 4, pp. 751–756, 2002
  91. Assessment of Investment Process for Producing Copper Hollow Spheres.
    MATERIALS TRANSACTIONS, vol. 43, no. 1, pp. 85–87, 2002
  92. Lead-Free Electronics Packaging. Interfacial Reactions Between Sn-58 mass%Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate.
    MATERIALS TRANSACTIONS, vol. 43, no. 8, pp. 1821–1826, 2002
  93. The Effect of Bi Concentration on Wettability of Cu Substrate by Sn-Bi Solders.
    MATERIALS TRANSACTIONS, vol. 42, no. 5, pp. 751–755, 2001
  94. Characterization of the thermal conductivity and mechanical properties of sheath alloy materials for Bi-2223 superconductor tapes
    IEEE Transactions on Appiled Superconductivity, vol. 11, no. 1, pp. 3277–3280, 2001
  95. Investigation of interfacial reaction between Sn-Ag eutectic solder and Au/Ni/Cu/Ti thin film metallization
    Journal of Electronic Materials, vol. 30, no. 9, pp. 1165–1170, 2001
  96. Journal of Materials Science Letters, vol. 18, no. 13, pp. 1063–1066, 1999
  97. Effects of silver additions on the mechanical properties and resistance to thermal shock of YBa2Cu3O7–d superconductors
    Cryogenics, vol. 39, no. 2, pp. 107–113, 1999
  98. Anomalous diffusion of Aluminum inß-Titanium
    Metallurgical and Materials Transactions A, vol. 25, no. 4, pp. 874–876, 1994
  99. Improvement of scanning accuracy of PZT piezoelectric actuators by feed-forward model-reference control
    Precision Engineering, vol. 16, no. 1, pp. 49–55, 1994
  100. Activation volumes in diffusion of copper, iron and silicon in Ni3Al intermetallic phase
    Journal of Materials Science Letters, vol. 12, no. 16, pp. 1294–1295, 1993