Tomi Laurila received the D.S. degree in electronics production technology from the Helsinki University of Technology, Helsinki, Finland in 2001 with honors. The thesis was focused on the solid-state reactions in different metal/silicon systems and development of feasible diffusion barriers to be used in Cu metallized ICs. At the moment, he works as a Teaching Scientist in the Group of Electronics Integration and Reliability and holds an Adjunct Professorship in electronics reliability and manufacturing. Presently, his research involves the study of interfacial reactions between dissimilar materials used in micro- and bioelectronics. His expertise includes solid-state diffusion, thermodynamics of materials, interfacial phenomena between dissimilar materials, surface phenomena, phase diagram calculations, thermal simulations, as well as reliability issues in microsystems. He has published extensively on the thermodynamic-kinetic analysis of interfacial reactions and issues related to reliability testing of electronic devices. He was also invited to be the author of SciTopics page: “Intermetallic compound layers related to lead-free soldering”. Dr. Laurila is also responsible for the teaching of material science, biocompatibility, and electronics reliability to both under- and postgraduate students in the Aalto University, Finland.
Biography Updated on 22 March 2011