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Articles in Scholarly Journals [Incomplete List]

1. Reliability improvement through nanoparticle material-based fiber structures
   Optical Fiber Technology, vol. 13, no. 1, pp. 27–31, 2007
2. Thermal properties of carbon nanotube array used for integrated circuit cooling
   Journal of Applied Physics, vol. 100, no. 7, p. 074302, 2006
3. Publisher's Note: “Thermal properties of carbon nanotube array used for integrated circuit cooling” [J. Appl. Phys. 100, 074302 (2006)]
   Journal of Applied Physics, vol. 100, no. 12, p. 129902, 2006
4. Effect of rapid thermal annealing (RTA) on thermal properties of carbon nanofibre (CNF) arrays
   Journal of Physics D: Applied Physics, vol. 39, no. 22, pp. 4878–4885, 2006
5. Bonding strength of a carbon nanofiber array to its substrate
   Journal of Materials Research, vol. 21, no. 11, pp. 2922–2926, 2006
6. Effective Young?s modulus of carbon nanofiber array
   Journal of Materials Research, vol. 21, no. 11, pp. 2948–2954, 2006
7. Modeling of Thermal Stress in Microelectronic and Photonic Structures: Role, Attributes, Challenges, and Brief Review
   Journal of Electronic Packaging, vol. 125, no. 2, p. 261, 2003
8. Bimaterial assembly with a low modulus bonding layer at the ends
   Journal of Applied Physics, vol. 93, no. 6, p. 3657, 2003
9. Could Shock Tests Adequately Mimic Drop Test Conditions?
   Journal of Electronic Packaging, vol. 124, no. 3, p. 170, 2002
10. Moisture Diffusion in Epoxy Molding Compounds Filled With Particles
    Journal of Electronic Packaging, vol. 123, no. 1, p. 47, 2001
11. Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach
    Journal of Electronic Packaging, vol. 123, no. 3, p. 260, 2001
12. Predicted thermal stresses in a bimaterial assembly adhesively bonded at the ends
    Journal of Applied Physics, vol. 89, no. 1, p. 120, 2001
13. Adhesively bonded assemblies with identical nondeformable adherends and 'piecewise continuous' adhesive layer: predicted thermal stresses in the adhesive
    International Journal of Solids and Structures, vol. 37, no. 16, pp. 2229–2252, 2000
14. Microelectronics and photonics — the future
    Microelectronics Journal, vol. 31, no. 11-12, pp. 839–851, 2000
15. Predicted thermally induced stresses in, and the bow of, a circular substrate/thin-film structure
    Journal of Applied Physics, vol. 88, no. 5, p. 2363, 2000
16. Optical fiber interconnect with the ends offset and axial loading: What could be done to reduce the tensile stress in the fiber?
    Journal of Applied Physics, vol. 88, no. 7, p. 3865, 2000
17. Predicted Fundamental Vibration Frequency of a Heavy Electronic Component Mounted on a Printed Circuit Board
    Journal of Electronic Packaging, vol. 122, no. 1, p. 3, 2000
18. Effects of the CTE and Young’s modulus lateral gradients on the bowing of an optical fiber: analytical and finite element modeling
    Optical Engineering, vol. 39, no. 12, p. 3317, 2000
19. Application of a ‘surrogate’ layer for lower bending stress in a vulnerable material of a tri-material body
    Microelectronics and Reliability, vol. 38, no. 12, pp. 1949–1954, 1998
20. Failure criterion for moisture-sensitive plastic packages of integrated circuit (IC) devices: Application of von Kármán's equations with consideration of thermoelastic strains
    International Journal of Solids and Structures, vol. 34, no. 23, pp. 2991–2993, 1997
21. Stresses in a partially coated optical glass fiber subjected to the ends off-set
    Journal of Lightwave Technology, vol. 15, no. 11, pp. 2091–2094, 1997
22. Probabilistic approach to evaluate improvements in the reliability of a chip-substrate (chip-card) assembly
    IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, vol. 20, no. 1, pp. 60–63, 1997
23. Dynamic response of a one-degree-of-freedom linear system to a shock load during drop tests: Effect of viscous damping
    IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, vol. 19, no. 3, pp. 435–440, 1996
24. Predicted curvatures and stresses in a fiber-optic interconnect subjected to bending
    Journal of Lightwave Technology, vol. 14, no. 2, pp. 144–147, 1996
25. Shock-excited vibrations of a conservative duffing oscillator with application to shock protection in portable electronics
    International Journal of Solids and Structures, vol. 33, no. 24, pp. 3627–3642, 1996
26. Shock protection with a nonlinear spring
    IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, vol. 18, no. 2, pp. 430–437, 1995
27. Dynamic response of a rectangular plate to a shock load, with application to portable electronic products
    IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, vol. 17, no. 3, pp. 449–460, 1994
28. Thermally induced stresses in an optical glass fiber soldered into a ferrule
    Journal of Lightwave Technology, vol. 12, no. 10, pp. 1766–1770, 1994
29. Approximate evaluation of the interfacial shearing stress in cylindrical double lap shear joints with application to dual-coated optical fibers
    International Journal of Solids and Structures, vol. 31, no. 23, pp. 3261–3283, 1994
30. The effect of the nonlinear stress-strain relationship on the mechanical behavior of optical glass fibers
    International Journal of Solids and Structures, vol. 30, no. 7, pp. 947–961, 1993
31. Can the curvature of an optical glass fiber be different from the curvature of its coating?
    International Journal of Solids and Structures, vol. 30, no. 17, pp. 2425–2435, 1993
32. Interfacial shearing stress in pull-out testing of dual-coated lightguide specimens
    Journal of Lightwave Technology, vol. 11, no. 12, pp. 1905–1913, 1993
33. Input/output fiber configuration in a laser package design
    Journal of Lightwave Technology, vol. 11, no. 12, pp. 2087–2092, 1993
34. Predicted Bow of Plastic Packages of Integrated Circuit (IC) Devices
    Journal of Reinforced Plastics and Composites, vol. 12, no. 9, pp. 951–972, 1993
35. Vibration frequency of a fused biconical taper (FBT) lightwave coupler
    Journal of Lightwave Technology, vol. 10, no. 7, pp. 898–902, 1992
36. Free vibrations of a fused biconical taper lightwave coupler
    International Journal of Solids and Structures, vol. 29, no. 24, pp. 3145–3152, 1992
37. Predicted curvature of a glass fiber from the measured curvature of its coating
    Journal of Lightwave Technology, vol. 9, no. 6, pp. 701–708, 1991
38. Mechanical approach to the evaluation of the low temperature threshold of added transmission losses in single-coated optical fibers
    Journal of Lightwave Technology, vol. 8, no. 6, pp. 863–868, 1990
39. Calculated stresses in dual coated optical fibers
    Polymer Engineering and Science, vol. 30, no. 2, pp. 108–117, 1990
40. Analysis of interfacial thermal stresses and adhesive strength of bi-annular cylinders
    International Journal of Solids and Structures, vol. 26, no. 5-6, pp. 581–600, 1990
41. Spring constant in the buckling of dual-coated optical fibers
    Journal of Lightwave Technology, vol. 6, no. 7, pp. 1240–1244, 1988
42. Effect of initial curvature on low temperature microbending in optical fibers
    Journal of Lightwave Technology, vol. 6, no. 8, pp. 1321–1327, 1988
43. New approach to the high quality epitaxial growth of lattice-mismatched materials
    Applied Physics Letters, vol. 49, no. 3, p. 140, 1986