FaXing Che received the Ph.D. degree in engineering mechanics from Nanyang Technological University, Singapore, in 2006. From 2006 to 2011, he worked as a Senior R&D Engineer at the United Test and Assembly Center, Singapore; a Senior Modeling and Design Engineer at STMicroelectronics, Singapore; a Scientist at Institute of Microelectronics, A*STAR, Singapore. Currently, he serves as a Staff Engineer at Infineon Technologies, Singapore. His research interests are in the areas of reliability assessment of advanced electronic packaging, finite-element modeling and simulation, characterization of microelectronic packaging materials, 3D IC packaging, and Through-Silicon-Vias reliability. He has authored and coauthored over 70 technical papers in refereed journals and conference proceedings. He received the Best Paper Award from ICEPT’2006, the Outstanding Student Paper Award from EPTC’2003, and the Best Poster Paper Award from Ither’2006. He was listed in Who’s Who in the World 2011.
Biography Updated on 7 December 2011