Zhuangjian Liu works as a Senior Scientist at Department of Mechanics Engineering, Institute of High Performance Computing, Singapore. He received Ph.D. and M.Eng. degrees from National University of Singapore, Singapore; an M.Eng. degree from Tongji University, Shanghai, China; and a B.S. degree from Tianjin University, Tianjin, China. His research areas include computational solid mechanics. Dr. Liu has been involved in Industrial collaborations, being the PI for numerous industrial projects with government agency and multinational companies, such as whole ship shock analysis, underwater shock analysis from DSTA and DSO, the coupled thermal-electrical analysis from Molex, and stress-strain analysis from HP and Phillips. His drive and dedication to excellence has allowed him to constantly deliver timely and outstanding work for each project, fostering close relationship between IHPC and the industry. Currently, his research work focuses on computational nanoelectronics and nanomechanics, including instability and buckling analysis, stretchable electronic system thermal analysis for multifunctional electrophysiological balloon catheters, and so forth; and the evaluation and improvement of the products design from the virtual simulation using high performance computing. His research work has brought about a deep scientific impact on his area of expertise, stretchable silicon systems. He has published numerous papers as coauthor in top journals such as Science and Nature Materials, including being the cover article of the prestigious PNAS journal. His paper on flexible electronics in science also gained much media publicity.
Biography Updated on 2 January 2013