Walter De Raedt

Articles in Scholarly Journals [Incomplete List]

  1. Photo-induced millimeter wave losses in coplanar waveguide on high resistivity silicon
    Microwave and Optical Technology Letters, vol. 49, no. 4, pp. 808–810, 2007
  2. CPW-FED fractal bow-tie antenna
    Microwave and Optical Technology Letters, vol. 49, no. 7, pp. 1587–1589, 2007
  3. Compact (<0.5 mm2) K-band metamaterial bandpass filter in MCM-D technology
    Electronics Letters, vol. 43, no. 5, p. 288, 2007
  4. High-<formula><tex>$Q$</tex></formula> Above-IC Inductors Using Thin-Film Wafer-Level Packaging Technology Demonstrated on 90-nm RF-CMOS 5-GHz VCO and 24-GHz LNA
    IEEE Transactions on Advanced Packaging, vol. 29, no. 4, pp. 810–817, 2006
  5. Accurate Multibias Equivalent-Circuit Extraction for GaN HEMTs
    IEEE Transactions on Microwave Theory and Techniques, vol. 54, no. 10, pp. 3616–3622, 2006
  6. Wafer-Level Package Interconnect Options
    IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 14, no. 6, pp. 654–659, 2006
  7. Low-Power Voltage-Controlled Oscillators in 90-nm CMOS Using High-Quality Thin-Film Postprocessed Inductors
    IEEE Journal of Solid-State Circuits, vol. 40, no. 9, pp. 1922–1931, 2005
  8. Filter-through device: a distributed RF-MEMS capacitive series switch
    Journal of Micromechanics and Microengineering, vol. 15, no. 7, pp. S97–S102, 2005
  9. RF-power: driver for electrostatic RF-MEMS devices
    Journal of Micromechanics and Microengineering, vol. 14, no. 9, pp. S43–S48, 2004
  10. Accurate RF Electrical Characterization of CSPs Using MCM-D Thin Film Technology
    IEEE Transactions on Advanced Packaging, vol. 27, no. 1, pp. 203–212, 2004
  11. SOP Integration and Codesign of Antennas
    IEEE Transactions on Advanced Packaging, vol. 27, no. 2, pp. 341–351, 2004
  12. CPW-Fed Stacked Microstrip Antennas
    IEEE Transactions on Antennas and Propagation, vol. 52, no. 1, pp. 74–83, 2004
  13. Wafer-Level Packaging Technology for High-<tex>$Q$</tex>On-Chip Inductors and Transmission Lines
    IEEE Transactions on Microwave Theory and Techniques, vol. 52, no. 4, pp. 1244–1251, 2004
  14. Modeling and characterization of the polymer stud grid array (PSGA) package: electrical, thermal and thermo-mechanical qualification
    IEEE Transactions on Electronics Packaging Manufacturing, vol. 26, no. 1, pp. 54–67, 2003
  15. High- RF inductors on 20?O.cm silicon realized through wafer-level packaging techniques
    Microelectronics International, vol. 20, no. 1, pp. 26–30, 2003
  16. MEMS for wireless communications:  from RF-MEMS components to RF-MEMS-SiP 
    Journal of Micromechanics and Microengineering, vol. 13, no. 4, pp. S139–S163, 2003
  17. The influence of packaging materials on RF performance
    Microelectronics Reliability, vol. 43, no. 3, pp. 351–357, 2003
  18. S-parameter reciprocity relations, normalization, and thru-line-reflect error box completion
    International Journal of RF and Microwave Computer-Aided Engineering, vol. 12, no. 5, pp. 418–427, 2002
  19. Organotin assemblies containing Sn_O bonds
    Coordination Chemistry Reviews, vol. 235, no. 1-2, pp. 1–52, 2002
  20. Electrical characterisation of BGA package for RF applications
    Microelectronics International, vol. 19, no. 2, pp. 13–18, 2002
  21. Single-package integration of RF blocks for a 5 GHz WLAN application
    IEEE Transactions on Advanced Packaging, vol. 24, no. 3, pp. 384–391, 2001
  22. Multilayer thin-film MCM-D for the integration of high-performance RF and microwave circuits
    IEEE Transactions on Components and Packaging Technologies, vol. 24, no. 3, pp. 510–519, 2001
  23. Accurate modeling of high-Q spiral inductors in thin-film multilayer technology for wireless telecommunication applications
    IEEE Transactions on Microwave Theory and Techniques, vol. 49, no. 4, pp. 589–599, 2001
  24. A direct Ku-band linear subharmonically pumped BPSK and I/Q vector modulator in multilayer thin-film MCM-D
    IEEE Transactions on Microwave Theory and Techniques, vol. 49, no. 8, pp. 1374–1382, 2001
  25. Integration of CPW quadrature couplers in multilayer thin-film MCM-D
    IEEE Transactions on Microwave Theory and Techniques, vol. 49, no. 10, pp. 1770–1776, 2001
  26. Characteristic impedance extraction using calibration comparison
    IEEE Transactions on Microwave Theory and Techniques, vol. 49, no. 12, pp. 2573–2579, 2001
  27. Novel approach for a design-oriented measurement-based fully scalable coplanar waveguide transmission line model
    IEE Proceedings - Microwaves, Antennas and Propagation, vol. 148, no. 4, p. 227, 2001
  28. Advances in microwave MCM-D technology
    Microelectronics International, vol. 17, no. 2, pp. 19–22, 2000
  29. HEMT parameter extraction combining optimization and direct parasitic extraction
    International Journal of RF and Microwave Computer-Aided Engineering, vol. 10, no. 1, pp. 81–90, 2000
  30. Chip-package codesign of a low-power 5-GHz RF front end
    Proceedings of the IEEE, vol. 88, no. 10, pp. 1583–1597, 2000
  31. Low-frequency gate current noise of InP based HEMTs
    Solid-State Electronics, vol. 43, no. 9, pp. 1797–1800, 1999
  32. Characterising differences between measurement and calibration wafer in probe-tip calibrations
    Electronics Letters, vol. 35, no. 13, p. 1087, 1999
  33. A new technique for in-fixture calibration using standards of constant length
    IEEE Transactions on Microwave Theory and Techniques, vol. 46, no. 9, pp. 1318–1320, 1998
  34. Improved HEMT model for low phase-noise InP-based MMIC oscillators
    IEEE Transactions on Microwave Theory and Techniques, vol. 46, no. 10, pp. 1583–1585, 1998
  35. Two new measurement methods for explicit determination of complex permittivity
    IEEE Transactions on Microwave Theory and Techniques, vol. 46, no. 11, pp. 1614–1619, 1998
  36. A simple error correction method for two-port transmission parameter measurement
    IEEE Microwave and Guided Wave Letters, vol. 8, no. 2, pp. 58–59, 1998
  37. Effect of Schottky barrier alteration on the low-frequency noise of InP-based HEMTs
    IEEE Electron Device Letters, vol. 19, no. 10, pp. 370–372, 1998
  38. Material and process related limitations of InP HEMT performance
    Materials Science and Engineering B, vol. 44, no. 1-3, pp. 311–315, 1997
  39. S-parameter measurement based quasistatic large-signal cold HEMT model for resistive mixer design
    International Journal of Microwave and Millimeter-Wave Computer-Aided Engineering, vol. 6, no. 4, pp. 250–258, 1996
  40. Electrooptic characterization of modulation-doped field-effect transistors with monolithically-integrated test fixtures
    Optical and Quantum Electronics, vol. 28, no. 7, pp. 867–874, 1996
  41. DC, LF dispersion and hf characterisation of short time stressed inp based LM-HEMTS
    Microelectronics and Reliability, vol. 36, no. 11-12, pp. 1911–1914, 1996
  42. Influence of kink effect on noise measurements in InP substrate PHEMTs at microwave frequencies
    Solid-State Electronics, vol. 39, no. 10, pp. 1423–1426, 1996
  43. Complex permittivity measurement method based on asymmetry of reciprocal two-ports
    Electronics Letters, vol. 32, no. 16, p. 1497, 1996
  44. Consistent small-signal and large-signal extraction techniques for heterojunction FET's
    IEEE Transactions on Microwave Theory and Techniques, vol. 43, no. 1, pp. 87–93, 1995
  45. Gate length electric parameter dependences of ultra-submicrometre d-doped pseudomorphic HEMTs
    Electronics Letters, vol. 29, no. 17, p. 1570, 1993
  46. Monolithic integration of InAs photodiode and GaAs MESFET
    Electronics Letters, vol. 28, no. 4, p. 372, 1992
  47. Experimental and theoretical investigation of parameter evolution of ultra-short gate standard and pseudomorphic HEMTs
    Microelectronic Engineering, vol. 19, no. 1-4, pp. 313–316, 1992
  48. Fabrication of 0.1-µm planar-doped pseudomorphic HEMT's using a PECVD silicon nitride assisted process
    Microelectronic Engineering, vol. 19, no. 1-4, pp. 321–324, 1992
  49. Cryogenic behavior of Ultrashort gate AlGaAs/GaAs and pseudomorphic AlGaAs/InGaAs/GaAs HEMT's
    Microelectronic Engineering, vol. 19, no. 1-4, pp. 861–864, 1992
  50. Long wavelength infra-red photoconductive InAsSb detectors grown in Si wells by molecular beam epitaxy
    Electronics Letters, vol. 26, no. 4, p. 259, 1990
  51. Rapid thermal annealing of sputtered TiW on GaAs
    Applied Surface Science, vol. 38, no. 1-4, p. 540, 1989
  52. Sub-100 nm gate MESFET by electron beam mix&match
    Microelectronic Engineering, vol. 9, no. 1-4, pp. 341–344, 1989
  53. MESFET lift-off from GaAs substrate to glass host
    Electronics Letters, vol. 25, no. 2, p. 136, 1989
  54. Infra-red intraband absorption detectors with etched 35° mesa facets for vertically incident light
    Electronics Letters, vol. 25, no. 14, p. 929, 1989