Gan Chong Leong0000-0002-2951-1192
Chong Leong Gan obtained his first degree from National University of Malaysia (UKM), Selangor, Malaysia, in chemical engineering, in 2000, and then received his M.S. degree in chemical instrumentation from the University of Science of Malaysia (USM), in 2003. He started his career with ASE Semiconductor upon graduation until 2002. He has 12 years of working experience in the wafer fabrication industry and semiconductor packaging. He held various positions while working with Silterra Malaysia, Altera Corporation, starting with Senior Engineer and MTS of product reliability, before joining Spansion (Penang) Sdn Bhd in early 2011. While working with Silterra, he has been involved in various activities such as setting up an OQA Laboratory, set up of Fab quality monitoring and wafer AOI, and has been involved extensively in product reliability development. He is actively involved in research and development activities especially in the area of microelectronics packaging and wafer fabrication. He has published over 10 papers internally and externally in conferences as well as several journals. His current interest is developing semiconductor reliability test and methodologies for flash memory packages.
Biography Updated on 26 December 2012