Sanming Hu is a Senior Member of IEEE. He received the B.Eng. degree from Nanjing University of Posts and Telecommunications, Nanjing, China, in 2004, and the Ph.D. degree (under the joint master-doctorate program) from Southeast University, Nanjing, China, in 2009. From 2006 to 2009, he was with Nanyang Technological University, Singapore, where he began and completed his doctoral research. From 2009 to 2013, he was with the Institute of Microelectronics, A*STAR (Agency for Science, Technology and Research), Singapore, as a Senior Research Engineer, a Scientist I, and then a Scientist II. He is currently with the Institute of Microwave Techniques, the University of Ulm, Ulm, Germany, as a Humboldt Research Fellow. He has (co)authored 50 refereed papers and filed 5 patents. His current research interests include millimeter-wave/terahertz integrated circuits with antennas, 3D integrated circuits, through-silicon via, and graphene. Dr. Hu is a guest editor for the International Journal of Antennas and Propagation (2014). He has also served as a Reviewer for several international journals, and a session Chair or Member of the Technical Program Committee for several international conferences. He was the recipient (as the first author) of the Best Paper Award of the IEEE Transaction on Components, Packaging, and Manufacturing Technology (2012) and the Bronze Award from the 1st Chip Design Competition held in conjunction with the 13th IEEE International Symposium on Integrated Circuits, 2011. He was also the recipient of a Research Fellowship of the Alexander von Humboldt Foundation, Germany (2013).
Biography Updated on 5 November 2014