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Articles in Scholarly Journals [Incomplete List]

1. Micromechanics of hardening of elastic–plastic crystals with elastic inclusions: I – Dilute concentration
   International Journal of Plasticity, vol. 23, no. 10-11, pp. 1901–1917, 2007
2. Effect of film thickness and laser energy density on the microstructure of a-GaAs films after excimer laser crystallization
   Journal of Applied Physics, vol. 102, no. 1, p. 013519, 2007
3. A novel structural-based approach to model the age hardening behaviour of aluminium alloys
   Modelling and Simulation in Materials Science and Engineering, vol. 14, no. 6, pp. 905–921, 2006
4. Spall behavior of aluminum with varying microstructures
   Journal of Applied Physics, vol. 99, no. 2, p. 023528, 2006
5. The effect of shock-loading on the aging behavior of an Al-Mg-Si alloy
   Journal of Materials Science, vol. 41, no. 6, pp. 1711–1720, 2006
6. The role of shear stress in the formation of annealing twin boundaries in copper
   Scripta Materialia, vol. 54, no. 6, pp. 983–986, 2006
7. Predicting thickness dependent twin boundary formation in sputtered Cu films
   Scripta Materialia, vol. 54, no. 6, pp. 999–1003, 2006
8. Microstructural evolution and observed stress response during hot deformation of 5005 and 6022 Al alloys
   Materials Science and Engineering: A, vol. 425, no. 1-2, pp. 205–212, 2006
9. The effect of predeformation on the ß? and ß' precipitates and the role of Q' phase in an Al–Mg–Si alloy; AA6022
   Scripta Materialia, 2005
10. Barrier layer, geometry and alloying effects on the microstructure and texture of electroplated copper thin films and damascene lines
    Thin Solid Films, vol. 471, no. 1-2, pp. 63–70, 2005
11. Analysis of local orientation gradients in deformed single crystals
    Ultramicroscopy, vol. 103, no. 1, pp. 33–39, 2005
12. Characterization of low angle grain boundaries in yttrium orthovanadate
    Journal of Materials Science, vol. 40, no. 13, pp. 3347–3353, 2005
13. Transmission electron microscopy and differential scanning calorimetry studies on the precipitation sequence in an Al?Mg?Si alloy: AA6022
    Journal of Materials Research, vol. 20, no. 10, pp. 2705–2711, 2005
14. Improving the Spatial Resolution of EBSD
    Microscopy and Microanalysis, vol. 11, no. S02, 2005
15. A systematic comparison of static and dynamic ageing of two Al–Mg–Si alloys
    Materials Science and Engineering A, vol. 373, no. 1-2, pp. 65–71, 2004
16. Observation of twin boundary migration in copper during deformation
    Materials Science and Engineering A, vol. 372, no. 1-2, pp. 173–179, 2004
17. Alloying effects on dislocation substructure evolution of aluminum alloys
    International Journal of Plasticity, vol. 20, no. 3, pp. 459–476, 2004
18. Hydrogen and deformation: Nano- and microindentation studies
    JOM, vol. 55, no. 2, pp. 47–50, 2003
19. Superior superplastic behavior in fine-grained Ti–6Al–4V sheet
    Journal of Alloys and Compounds, vol. 345, no. 1-2, pp. 221–227, 2002
20. The flow stress behavior of OFHC polycrystalline copper
    Acta Materialia, vol. 49, no. 11, pp. 2065–2074, 2001
21. Investigating the microstructure-reliability relationship in Cu damascene lines
    Scripta Materialia, vol. 45, no. 9, pp. 1069–1075, 2001
22. Heterogeneity of crystallographic texture in friction stir welds of aluminum
    Metallurgical and Materials Transactions A, vol. 32, no. 11, pp. 2869–2877, 2001
23. EM activation energy in aluminum conductors tested by the drift velocity method
    Scripta Materialia, vol. 42, no. 6, pp. 621–626, 2000
24. Recent studies of local texture and its influence on failure
    Materials Science and Engineering A, vol. 257, no. 1, pp. 165–170, 1998
25. Recent advances in the application of orientation imaging
    Ultramicroscopy, vol. 67, no. 1-4, pp. 1–9, 1997
26. Local textures and grain boundaries in voided copper interconnects
    Journal of Electronic Materials, vol. 26, no. 9, pp. 996–1001, 1997
27. Grain boundary misorientation angles and stress-induced voiding in oxide passivated copper interconnects
    Applied Physics Letters, vol. 70, no. 10, p. 1242, 1997
28. Analysis of grain-boundary structure in Al–Cu interconnects
    Journal of Applied Physics, vol. 82, no. 5, p. 2383, 1997
29. Rodrigues parameterization for orientation and misorientation distributions
    Philosophical Magazine A, vol. 73, no. 4, pp. 1113–1130, 1996
30. Microstructure mapping of interconnects by orientation imaging microscopy
    Journal of Electronic Materials, vol. 25, no. 11, pp. 1767–1771, 1996
31. Quantification of partially recrystallized polycrystals using electron backscatter diffraction
    Materials Science and Engineering A, vol. 190, no. 1-2, pp. 241–246, 1995
32. On the asymmetric domain of cubic misorientations
    Scripta Metallurgica et Materialia, vol. 32, no. 1, pp. 67–70, 1995