Zhenshan Cui

Shanghai Jiao Tong University, China

Zhenshan Cui is currently a Professor at the Institute of Forming Technology and Equipment, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, China. He received the B.S. and M.S. degrees from Jilin University, Changchun, China, and the Ph.D. degree from Yanshan University, Qinhuangdao, China. He was a Postdoc at Tsinghua University, Beijing, China. He became a Professor at Yanshan University in 2000, and joined Shanghai Jiao Tong University as a Professor in 2002. His primary research interest is the mechanics problems and numerical modeling in metal processing and microstructure evolution and prediction in metal hot working. Current research investigations involve modeling and simulation of void evolution during hot forging process, microstructural prediction of steels during multihit hot forming process, and modeling of rupture criterion in hot forging. Now he and his research group undertake research projects at National Basic Research Program of China (973 Program), National Science and Technology Major Project of China, National Natural Science Foundation of China, Project of Science and Technology Commission of Shanghai Municipality, and some projects on industries. These research works are relevant to the hot forging of heavy ingots as well as slab rolling. Besides that, his research group also performed many projects for industries on design simulation of automotive safety systems and other key structural components or systems. Professor Cui is currently a Senior Member of the Chinese Mechanical Engineering Society, a Member of Chinese Society of Theoretical and Applied Mechanics, and a Member of the editorial board of the Journal of Plasticity Engineering. He was a Guest Professor at Kumamoto University, Kumamoto, Japan. He published more than 100 research papers with his students or colleagues and 3 authored China patents and 1 published book.

Biography Updated on 30 August 2012

Scholarly Contributions [Data Provided by scopus]

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