Articles in Scholarly Journals [Incomplete List]

1. Study on the chimney effect in natural air-cooled electronic equipment casings under inclination: Proposal of a thermal design correlation that includes the porosity coefficient of an outlet opening
   Heat Transfer—Asian Research, vol. 35, no. 2, pp. 122–136, 2006
2. Operation Time Control of a High Density Packaging Using a Low Melting Point Alloy
   IEEE Transactions on Components and Packaging Technologies, vol. 27, no. 2, pp. 239–243, 2004
3. Chimney Effect on Natural Air Cooling of Electronic Equipment Under Inclination
   Journal of Electronic Packaging, vol. 126, no. 4, p. 423, 2004
4. Development of thermal flow simulation method for switch mode power supplies and its integration with electric circuit analysis (in the case of natural convection air cooled switch mode power supply)
   Heat Transfer?Asian Research, vol. 33, no. 8, pp. 473–489, 2004
5. Numerical and experimental study of the effect of inclination on the thermal behaviour of natural convection inside a thin electronic equipment casing
   Proceedings of the Institution of Mechanical Engineers, Part A: Journal of Power and Energy, vol. 218, no. 7, pp. 501–508, 2004
6. Studies on natural convection-induced flow and thermal behaviour inside electronic equipment cabinet model
   Proceedings of the I MECH E Part A Journal of Power and Energy, vol. 217, no. 3, pp. 323–328, 2003
7. Study on the natural air cooling of electronic equipment casings: effects of the outlet vent and the power heater locations on the cooling capability
   Proceedings of the Institution of Mechanical Engineers, Part A: Journal of Power and Energy, vol. 216, no. 3, pp. 269–275, 2002
8. Design optimization of axial flow hydraulic turbine runner: Part I?an improved Q3D inverse method
   International Journal for Numerical Methods in Fluids, vol. 39, no. 6, pp. 517–531, 2002
9. Design optimization of axial flow hydraulic turbine runner: Part II?multi-objective constrained optimization method
   International Journal for Numerical Methods in Fluids, vol. 39, no. 6, pp. 533–548, 2002
10. Development of an eco-sensor for the continuous monitoring of environmental volatile organic chlorinated compounds
    Measurement Science and Technology, vol. 13, no. 11, pp. 1786–1792, 2002
11. An Improved CIP-CUP Method for Submerged Water Jet Flow Simulation.
    JSME International Journal Series B, vol. 44, no. 4, pp. 497–504, 2001
12. Development of Micro Channel Heat Exchanging
    JSME International Journal Series B, vol. 44, no. 4, pp. 592–598, 2001
13. Application of a semi-empirical approach to the thermal design of electronic equipment
    Proceedings of the Institution of Mechanical Engineers, Part A: Journal of Power and Energy, vol. 214, no. 5, pp. 513–522, 2000
14. Experimental study on the performance of a compact heat sink for LSI packages
    Proceedings of the Institution of Mechanical Engineers, Part A: Journal of Power and Energy, vol. 214, no. 5, pp. 523–530, 2000
15. Development of prediction technique for cooling performance of finned heat sink in uniform flow
    IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, vol. 20, no. 2, pp. 160–166, 1997
16. Application of the thermal network method to the transient thermal analysis of multichip modules
    Heat Transfer - Japanese Research, vol. 26, no. 8, pp. 541–553, 1997
17. Cooling performance of plate fins for multichip modules
    IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, vol. 18, no. 3, pp. 592–595, 1995
18. Thermal Analysis of a New High Density Package Cooling Technology Using Low Melting Point Alloys
    Japanese Journal of Applied Physics, vol. 30, no. Part 1, No. 6, pp. 1313–1319, 1991
19. New Package Cooling Technology Using Low Melting Point Alloys
    Japanese Journal of Applied Physics, vol. 29, no. Part 1, No. 7, pp. 1377–1384, 1990
20. An Application of the Thermal Network Method to the Thermal Analysis of Multichip Packages (Proposal of a Simple Thermal Analysis Model)
    Japanese Journal of Applied Physics, vol. 28, no. Part 1, No. 9, pp. 1578–1585, 1989
21. Thermal studies on finned LSI packages using forced convection
    IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 12, no. 4, pp. 753–756, 1989