Fu‐Chien Chiu was born in Tainan, Taiwan. He received the B.S. degree in physics from Fu‐Jen Catholic University, New Taipei, Taiwan, in 1991, and the M.S. degree in electrical engineering and the Ph.D. degree in electronics engineering from the National Tsing‐Hua University, Hsinchu, Taiwan, in 1996 and 2005, respectively. His M.S. degree research was focused on the application of Ta2O5 thin films as the capacitor dielectric of DRAM. His Ph.D. degree research was focused on the study of the electrical characteristics of metal‐oxide‐semiconductor capacitors and MOSFETs using high‐dielectric‐constant thin films as the gate dielectrics. He served his military duty in Taiwan as an Officer in the army for two years. From 1996 to 1999, he was with the Winbond Electronics Corporation, Hsinchu, where he worked on SRAM/DRAM process integration, process development and device reliability, and SRAM product engineering. In 2000, he was with Myson Technology, Inc., Hsinchu, where he worked on BJT analog circuit design. From 2001 to 2006, he rejoined the Winbond Electronics Corporation, where he worked on ESD and latch‐up protection design, device and product reliability engineering, and device wafer‐level reliability assessments. In February 2006, he joined the faculty of the Department of Electronic Engineering, Ming Chuan University, Taoyuan, Taiwan, as an Assistant Professor, where he has been a Professor since February 2013. His current research interests include thin film dielectric breakdown and reliability, fabrication and characterization of semiconductor devices, nonvolatile memory devices, and high‐k thin film applications. He is the holder of 15 patents and has published over 50 journal publications and conference proceedings.
Biography Updated on 20 May 2015