Editorial Board

• Hisham A. Abdel-Aal, Ecole Nationale Supérieure d'Arts et Métiers, France
• Waqar Ahmed, University of Central Lancashire, United Kingdom
• Bilal A. Akash, Dhofar University, Oman
• Farid Al-Bender, Katholieke Universiteit Leuven, Belgium
• Sergei Alexandrov, Russian Academy of Sciences, Russia
• Jorge Antunes, University of Coimbra, Portugal
• Viktor P. Astakhov, General Motors Corporation, USA
• Jan Awrejcewicz, The Technical University of Lodz, Poland
• Nazlim Bagcivan, RWTH Aachen University, Germany
• Laurent Baillet, Universite Joseph Fourier, France
• Sergio Baragetti, Università degli Studi di Bergamo, Italy
• Nektaria-Marianthi Barkoula, University of Ioannina, Greece
• Jayashree Bijwe, Indian Institute of Technology, India
• Lefteris Bourithis, Halyvourgiki Steel Plant SA, Greece
• Noël Brunetière, Université de Poitiers, France
• Vernon E. Buchanan, University of Technology, Jamaica
• Marie-Ange Bueno, Ecole Nationale Supérieure d'Ingénieurs de Sud Alsace, France
• Rachel J. Cannara, National Institute of Standards and Technology, USA
• Giuseppe Carbone, Politecnico di Bari, Italy
• Ulaş Çaydaş, University of Firat, Turkey
• Patrick Chabrand, Université de la Méditerranée et CNRS, France
• Ti Jun Chen, Lanzhou University of Technology, China
• Chi-Hui Chien, National Sun Yat-Sen University, Taiwan
• Debdulal Das, Bengal Engineering And Science University, India
• Juan De Vicente, University of Granada, Spain
• Jean Denape, École Nationale d'Ingénieurs de Tarbes, France
• Yannick Desplanques, Ecole Centrale de Lille, France
• Martin Dienwiebel, Fraunhofer-Institut fuer Werkstoffmechanik, Germany
• Matevž Dular, University of Ljubljana, Slovenia
• Tahany El-Wardany, United Technologies Research Center, USA
• Manuel Evaristo, Universidade de Coimbra, Portugal
• Dominique Eyheramendy, Ecole Centrale Marseille, France
• George R. Fenske, Argonne National Laboratory, USA
• Michel Fillon, University of Poitiers, France
• Fehim Findik, Sakarya University, Turkey
• Christian Gauthier, University of Strasbourg, France
• Ille C. Gebeshuber, Universiti Kebangsaan Malaysia, Malaysia
• Nikos Gerolymos, National Technical University of Athens, Greece
• Rajappa Gnanamoorthy, Indian Institute of Technology Madras, India
• Enrico Gnecco, IMDEA Nanociencia, Spain
• Xing-Cai Guo, Western Digital Corporation, USA
• Ridha Hambli, Polytech Orleans, France
• Jeng Hour Horng, National Formosa University, Taiwan
• Abdellatif Imad, Université de Lille 1, France
• Mohammad J. Jaffar, Loughborough University, United Kingdom
• Jer Huan Jang, Ming Chi University of Technology, Taiwan
• Tohru Kanada, Kanto Gakuin University, Japan
• Masahiko Kato, Hiroshima University, Japan
• Seock-Sam Kim, Kyungpook National University, Republic of Korea
• Daejong Kim, University of Texas at Arlington, USA
• Michal Kuciej, Bialystok University of Technology, Poland
• Chih Lin, Baker Hughes, USA
• Xianping Liu, University of Warwick, United Kingdom
• Yafei Lu, Beijing Unversity of Chemical Technology, China
• Jyotsna Dutta Majumdar, Indian Institute of Technology Kharagpur, India
• Junhong Mao, Xi''an Jiaotong University, China
• Francesco Massi, Instituts Nationaux des Sciences Appliquees, France
• Paul T. Mativenga, The University of Manchester, United Kingdom
• Samir Mekid, King Fahd University Petroleum & Minerals, Saudi Arabia
• Pradeep Lancy Menezes, University of Wisconsin-Milwaukee, USA
• Fanming Meng, Chongqing university, China
• Ichiro Minami, Chemical Engineering Department, Iwate University, 4-3-5 Ueda, Morioka, Japan
• Ardian Morina, University of Leeds, United Kingdom
• Abdelhadi Moufki, Universite Paul Verlaine - Metz, France
• Takashi Murakami, National Institute of Advanced Industrial Science and Technology (AIST), Japan
• Masayoshi Muraki, Shonan Institute of Technology, Japan
• Fehmi Nair, Erciyes University, Turkey
• Keiji Nakayama, Chiba Institute of Technology, Japan
• George Nikas, Imperial College London, United Kingdom
• Marta C. Oliveira, University of Coimbra, Portugal
• Jia-Hu Ouyang, Harbin Institute of Technology, China
• Christ Paul, Raja Ramanna Centre for Advanced Technology, India
• Pawel Pawlus, Rzeszow University of Technology, Poland
• Linfa Peng, Shanghai Jiao Tong University, China
• Braj Kishore Prasad, Advanced Materials and Processes Research Institute, India
• Linmao Qian, Southwest Jiaotong University, China
• Mamidala Ramulu, University of Washington, USA
• Joel Rech, University of Lyon, France
• Guido Reisel, Sulzer Metco WOKA GmbH, Germany
• Caroline Richard, University of Tours Français Rabelais, France
• François Robbe-Valloire, Supmeca Lismma, France
• Xavier Roizard, École Nationale Supérieure de Mécanique et des Microtechniques, France
• Bengt-Göran Rosen, Halmstad University, Sweden
• Manish Roy, Defence Metallurgical Research Laboratory, India
• Prasanta Sahoo, Jadavpur University, India
• Mohamed A. Seddeek, Helwan University, Egypt
• Velusamy Senthilkumar, National Institute of Technology, India
• Gang Sheng, University of Alaska, USA
• Tadeusz Stolarski, Brunel University, United Kingdom
• Jeffrey L. Streator, Georgia Institute of Technology, USA
• In-Ha Sung, Hannam University, Republic of Korea
• Santhosh Suresh, National Institute of Technology, India
• Bhimappa Suresha, The National Institute of Engineering, India
• Guy Sutter, Université de Lorraine, France
• Dairene Uy, Ford Motor Company, USA
• Nikolaos Vaxevanidis, School of Pedagogical & Technological Education (ASPETE), Greece
• Philippe Velex, Université de Lyon, France
• James Wang, Swinburne University of Technology, Australia
• Jiadao Wang, Tsinghua University, China
• Nenzi Wang, Chang Gung University, Taiwan
• Zefeng Wen, Southwest Jiaotong University, China
• Huilin Xing, The University of Queensland, Australia
• Shangwu Xiong, Sentient corporation, USA
• Shuen Huei Yao, Chang Jung Christian University, Taiwan
• Sahin Yildirim, Erciyes University, Turkey
• Hassan Zahouani, Ecole Centrale de Lyon, France
• Yongzhen Zhang, Henan University of Science and Technology, China
• Haiping Zhu, University of Western Sydney, Australia
• Qian Zou, Oakland University, USA