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Advances in Acoustics and Vibration
Volume 2012 (2012), Article ID 874081, 12 pages
Ultrasonic Flaw Imaging via Multipath Exploitation
1Center for Advanced Communications, Villanova University, Villanova, PA 19085, USA
2Electrical and Automatic School, Shanghai Institute of Technology, Shanghai 201418, China
Received 15 December 2011; Accepted 28 April 2012
Academic Editor: Erdal Oruklu
Copyright © 2012 Yimin D. Zhang et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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