Editorial Board

• Jorge P. Arenas, Universidad Austral de Chile, Chile
• Marc Asselineau, Peutz Consulting Engineers, France
• Miguel Ayala Botto, Instituto Superior Técnico, Portugal
• Abul Azad, Northern Illinois University, USA
• Rama B. Bhat, Concordia University, Canada
• Mikhail Bogush, Piezoelektrik Ltd., Russia
• S. Daley, University of Sheffield, United Kingdom
• Nico F. Declercq, Georgia Institute of Technology, France
• Arnaud Deraemaeker, ULB, Belgium
• Tamer Elnady, Ain Shams University, Egypt
• Luc Gaudiller, INSA de Lyon, French engineering university, France
• Samir Yousri Gerges, Federal University of Santa Catarina, Brazil
• Lars Hakansson, Blekinge Institute of Technology, Sweden
• Akira Ikuta, Prefectural University of Hiroshima, Japan
• Sven Johansson, Blekinge Institute of Technology, Sweden
• Jian Kang, University of Sheffield, United Kingdom
• Joseph CS Lai, The University of New South Wales (ADFA), Australia
• K. M. Liew, City University of Hong Kong, Hong Kong
• Emil Manoach, Bulgarian Academy of Sciences, Bulgaria
• Fidel E. Hernandez Montero, Universidad de Pinar del Río, Cuba
• Toru Otsuru, Faculty of Engineering, Oita University, Japan
• Marek Pawelczyk, Silesian University of Technology, Poland
• Stanislaw Pietrzko, Empa Materials Science and Technology, Switzerland
• Woojae Seong, Seoul National University, Republic of Korea
• Benjamin Soenarko, Institute of Technology Bandung, Indonesia
• Mohammad Tawfik, Cairo University, Egypt
• Jing Tian, Chinese Academy of Sciences, China
• Mikio Tohyama, Waseda University, Japan
• M. O. Tokhi, University of Sheffield, United Kingdom
• Gurvinder S. Virk, University of Gävle, Sweden
• Massimo Viscardi, Università degli Studi di Napoli Federico II, Italy
• Yuezhe Zhao, South China University of Technology, China