Integration of Networks of Sensors and Electronics for Structural Health Monitoring of Composite Materials

<table>Photomicrograph of the resin pocket area around the embedded dummy microprocessor in <svg height="9.5625" id="M45" style="vertical-align:-0.3003pt" version="1.1" viewbox="0 0 10.1 9.5625" width="10.1" xmlns="http://www.w3.org/2000/svg" xmlns:xlink="http://www.w3.org/1999/xlink">
<g transform="matrix(.017,-0,0,-.017,.062,9.125)"><path d="M535 290h-212v-206h-58v206h-213v50h213v193h58v-193h212v-50zM535 -22h-483v50h483v-50z" id="xB1"></path></g>
</svg>45 degree laminates.</table>

Advances in Civil Engineering

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Figure 4

Figure 4: Integration of Networks of Sensors and Electronics for Structural Health Monitoring of Composite Materials 