Current Status of Magnetoelectric Composite Thin/Thick Films

Table 3

Summary of advantages/disadvantages of ME composite films with different connectivity.

Connectivity	Advantage	Disadvantage	Remarks
0-3	Easy processing.	Low resistivity (difficult to pole). Low ME property.	Sintering with ceramic power mixture. Ceramic/polymer composite.
	Easy fabrication. High resistivity. Good ME property.	Interdiffusion. Thermal expansion mismatch.	Cofiring at high temperature.; All ceramic materials. Tape casting.
2-2	High resistivity. Low-temperature processing. Coherent interface. Precise control of the lattice mismatching and thickness in the atomic scale.	Weak ME effect.	Thin film process layer by layer. Integrated ME devices.
	Easy fabrication. High resistivity.	Only bulk material.; Low mechanical strength from epoxy bonding.	Epoxy bonding at room temperature. Ceramic/magnetic metal alloy.
1-3	Coherent interface in an atomic scale.	Low resistivity. Hard to fabricate.	Large in-plane strain. Thin film process.