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Advances in Mechanical Engineering
Volume 2012 (2012), Article ID 183853, 12 pages
Research Article

Experimental Study of the Cooling of Electrical Components Using Water Film Evaporation

1Université Lille Nord de France, 59000 Lille, France
2UVHC, TEMPO, 59313 Valenciennes, France
3Alstom Transport, Valenciennes, France
4Alstom Transport, Charleroi, Belgium

Received 18 July 2012; Revised 24 September 2012; Accepted 2 October 2012

Academic Editor: Kim Choon Ng

Copyright © 2012 S. Harmand et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


Heat and mass transfer, which occur in the evaporation of a falling film of water, are studied experimentally. This evaporation allows the dissipation of the heat flux produced by twelve resistors, which simulate electrical components on the back side of an aluminium plate. On the front side of the plate, a falling film of water flows by the action of gravity. An inverse heat conduction model, associated with a spatial regularisation, was developed and produces the local heat fluxes on the plate using the measured temperatures. The efficiency of this evaporative process has been studied with respect to several parameters: imposed heat flux, inlet mass flow rate, and geometry. A comparison of the latent and sensible fluxes used to dissipate the imposed heat flux was studied in the case of a plexiglass sheet in front of the falling film at different distances from the aluminium plate.