Editorial Board

Koshi Adachi, Tohoku University, Japan
Mehdi Ahmadian, Virginia Polytechnic Institute and State University, USA
Rehan Ahmed, Heriot-Watt University, United Kingdom
Claude Bathias, Université Paris Ouest Nanterre La Défense, France
Adib Becker, University of Nottingham, United Kingdom
Leonardo Bertini, University of Pisa, Italy
L. A. Blunt, niversity of Huddersfield, United Kingdom
Marco Ceccarelli, University of Cassino, Italy
Hyung Hee Cho, Yonsei University, Republic of Korea
Seung Bok Choi, Inha University, Korea
Bogdan I. Epureanu, University of Michigan, USA
M. R. Eslami, Amirkabir University of Technology, Iran
A. Faghri, University of Connecticut, USA
Ali Fatemi, University of Toledo, USA
Siegfried Fouvry, Ecole Centrale de Lyon, France
Ian Frigaard, University of British Columbia, Canada
M. I. Friswell, Swansea University, United Kingdom
Yuebin Guo, The University of Alabama, USA
Zhen Huang, Yanshan University, China
Thomas H. Hyde, University of Nottingham, United Kingdom
Jiin Yuh Jang, National Cheng Kung University, Taiwan
Zhongmin Jin, University of Leeds, United Kingdom
Essam Eldin Khalil, Cairo University, Egypt
Xianwen Kong, Heriot-Watt University, United Kingdom
Jaw-Ren Lin, Nanya Institute of Technology, Taiwan
Cheng-Xian Lin, Florida International University, USA
Oronzio Manca, Second University of Naples, Italy
Aristide Fausto Massardo, Università degli Studi di Genova, Italy
Kim Choon Ng, National University of Singapore, Singapore
C. T. Nguyen, Université de Moncton, Canada
Hirosi Noguchi, University of Shizuoka, Japan
Andrew Ooi, University of Melbourne, Australia
Hakan F. Oztop, Fırat University, Turkey
Duc Truong Pham, Cardiff University, United Kingdom
Homer Rahnejat, Loughborough University, United Kingdom
S. Rakheja, Concordia University, Canada
John E. Renaud, University of Notre Dame, USA
Robert L. Reuben, Heriot-Watt University, United Kingdom
Bidyut Baran Saha, National University of Singapore, Singapore
Dik J. Schipper, University of Twente, The Netherlands
Steven R. Schmid, University of Notre Dame, USA
A. Seshadri Sekhar, Indian Institute of Technology Madras, India
C. S. Shin, National Taiwan University, Taiwan
Yung C. Shin, Purdue University, USA
Ray W. Snidle, Cardiff University, United Kingdom
Christian Soize, Université Paris-Est Marne-la-Vallée, France
Margaret M. Stack, University of Strathclyde, United Kingdom
Neil Stephen, University of Southampton, United Kingdom
Kumar K. Tamma, University of Minnesota, USA
Yaya Tan, Tianhua Architecture Limited Company, China
Cho W. Solomon To, Department of Mechanical Engineering, University of Nebraska, USA
Yoshihiro Tomita, Kobe University, Japan
Shandong Tu, East China University of Science and Technology, China
Moran Wang, Los Alamos National Laboratory, USA
Fengfeng Xi, Ryerson University, Canada
Hiroshi Yabuno, Keio University, Japan
Wei Mon Yan, Huafan University, Taiwan
Byeng D. Youn, Mechanics Michigan Technological University, USA
Zhongrong Zhou, Southwest Jiaotong University, China