Editorial Board

• Koshi Adachi, Tohoku University, Japan
• Mehdi Ahmadian, Virginia Polytechnic Institute and State University, USA
• Rehan Ahmed, Heriot-Watt University, United Kingdom
• Claude Bathias, Université Paris Ouest Nanterre La Défense, France
• Adib Becker, University of Nottingham, United Kingdom
• Leonardo Bertini, University of Pisa, Italy
• L. A. Blunt, niversity of Huddersfield, United Kingdom
• Marco Ceccarelli, University of Cassino, Italy
• Hyung Hee Cho, Yonsei University, Republic of Korea
• Seung Bok Choi, Inha University, Korea
• Bogdan I. Epureanu, University of Michigan, USA
• M. R. Eslami, Amirkabir University of Technology, Iran
• A. Faghri, University of Connecticut, USA
• Ali Fatemi, University of Toledo, USA
• Siegfried Fouvry, Ecole Centrale de Lyon, France
• Ian Frigaard, University of British Columbia, Canada
• M. I. Friswell, Swansea University, United Kingdom
• Yuebin Guo, The University of Alabama, USA
• Jiin Yuh Jang, National Cheng Kung University, Taiwan
• Zhongmin Jin, University of Leeds, United Kingdom
• Essam Eldin Khalil, Cairo University, Egypt
• Xianwen Kong, Heriot-Watt University, United Kingdom
• Jaw-Ren Lin, Nanya Institute of Technology, Taiwan
• Cheng-Xian Lin, Florida International University, USA
• Oronzio Manca, Second University of Naples, Italy
• Aristide Fausto Massardo, Università degli Studi di Genova, Italy
• Kim Choon Ng, National University of Singapore, Singapore
• C. T. Nguyen, Université de Moncton, Canada
• Hirosi Noguchi, University of Shizuoka, Japan
• Andrew Ooi, University of Melbourne, Australia
• Hakan F. Oztop, Fırat University, Turkey
• Duc Truong Pham, Cardiff University, United Kingdom
• S. Rakheja, Concordia University, Canada
• John E. Renaud, University of Notre Dame, USA
• Robert L. Reuben, Heriot-Watt University, United Kingdom
• Bidyut Baran Saha, National University of Singapore, Singapore
• Dik J. Schipper, University of Twente, The Netherlands
• Steven R. Schmid, University of Notre Dame, USA
• A. Seshadri Sekhar, Indian Institute of Technology Madras, India
• C. S. Shin, National Taiwan University, Taiwan
• Yung C. Shin, Purdue University, USA
• Ray W. Snidle, Cardiff University, United Kingdom
• Christian Soize, Université Paris-Est Marne-la-Vallée, France
• Margaret M. Stack, University of Strathclyde, United Kingdom
• Neil Stephen, University of Southampton, United Kingdom
• Kumar K. Tamma, University of Minnesota, USA
• Yaya Tan, Tianhua Architecture Limited Company, China
• Cho W. Solomon To, University of Nebraska, USA
• Yoshihiro Tomita, Kobe University, Japan
• Shandong Tu, East China University of Science and Technology, China
• Moran Wang, Los Alamos National Laboratory, USA
• Fengfeng Xi, Ryerson University, Canada
• Hiroshi Yabuno, Keio University, Japan
• Wei Mon Yan, Huafan University, Taiwan
• Byeng D. Youn, Mechanics Michigan Technological University, USA
• Zhongrong Zhou, Southwest Jiaotong University, China