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Mechatronics and Embedded System 2014

Call for Papers

Mechatronics and embedded-system technology is strategically a leading-edge high technology, which provides important support and storage for promoting the sustainable development of the autonomous design and developing competence of intelligent equipments.

Based on the strategic development demand in the future in the field of advanced manufacturing technology, intensively studying the mechatronics and embedded-system technology in the fields of intelligence, bionics, minirobot interaction, network-based coordinate, and so forth, designs key technology units and parts in the aspects of development of mechanism, drive, sensor, and controlling method and gradually builds top integrated demonstration systems.

We invite investigators to contribute original research articles as well as review articles that will stimulate the continuing efforts to the development of mechatronics and embedded system. Potential topics include, but are not limited to:

  • Embedded-systems hardware design and architecture
  • Design automation of mechatronics and embedded-system hardware/software codesign methods
  • Novel complex embedded architectures, systems on chip (SoC), systems on a programmable/reconfigurable chip (SoPC), multiprocessors on a chip (MPoC), and network-on-chip (NoC)
  • Advanced mechatronics devices, mechatronics sensing, control, smart actuators, and materials
  • Control-system modeling and simulation techniques, intelligent control, neurocontrol, and fuzzy control
  • Sensors and multisensor data fusion algorithms
  • Advanced measurement and machine vision system
  • Novel applications of mechatronics technology and embedded system
  • Industrial automation and process control, industrial robotics, and automation
  • Internet of Things and embedded system application

Before submission authors should carefully read over the journal’s Author Guidelines, which are located at http://www.hindawi.com/journals/ame/guidelines/. Prospective authors should submit an electronic copy of their complete manuscript through the journal Manuscript Tracking System at http://mts.hindawi.com/submit/journals/ame/mes14/ according to the following timetable:

Manuscript DueFriday, 14 March 2014
First Round of ReviewsFriday, 6 June 2014
Publication DateFriday, 1 August 2014

Lead Guest Editor

  • Yong Tao, School of Mechanical Engineering, Beihang University, Beijing, China

Guest Editors

  • Tan Jindong, The University of Tennessee, Knoxville, TN, USA
  • Shao Zili, The Hong Kong Polytechnic University, Hong Kong
  • Hongxing Wei, School of mechanical engineering, Beihang University, Beijing, China