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Heat Transfer in Nanofluids 2013

Call for Papers

Heat transfer enhancement determines the need for new and innovative coolants with improved performance. The novel concept of “nanofluids” has been proposed as a route to surpassing the performance of heat transfer fluids currently available. Several investigations have revealed that the thermal conductivity of the fluid containing nanoparticles could be increased by more than 20% for the case of very low nanoparticle concentrations. Nowadays, a fast growth of research activity in this heat transfer area has arisen, as also showed in the previous two special issues of this new series “Heat Transfer in Nanofluids” in 2010 and 2012. The new challenge is to establish the possible advantage to employ nanofluids in engineering applications, and this third issue on “Heat Transfer in Nanofluids” tries to give some possible answers.

Thus, we invite authors to submit original research articles as well as review articles on the most recent developments and research efforts in this field, with the purpose of providing guidelines for future research directions. Potential topics include, but are not limited to:

  • Experimental techniques for measuring thermal properties of nanofluids
  • Single-phase convection
  • Natural and forced convection cooling
  • Pool and flow boiling applications
  • Nucleate boiling and critical heat flux and post-CHF measurements
  • Flow and heat transfer characteristics in the laminar and turbulent regimes
  • Modeling of flow and heat transfer behavior of nanoparticles, nanotubes, and nanofluids under equilibrium and nonequilibrium conditions
  • Applications including cooling of electronics, vehicles, fuel cells, transformers, nuclear systems, space systems, drilling, lubrication, thermal storage, drag reduction, and biomedical applications

Before submission authors should carefully read over the journal’s Author Guidelines, which are located at http://www.hindawi.com/journals/ame/guidelines/. Prospective authors should submit an electronic copy of their complete manuscript through the journal Manuscript Tracking System at http://mts.hindawi.com/submit/journals/ame/htn13/ according to the following timetable:

Manuscript DueFriday, 14 June 2013
First Round of ReviewsFriday, 6 September 2013
Publication DateFriday, 1 November 2013

Lead Guest Editor

  • Oronzio Manca, Dipartimento di Ingegneria Industriale e dell'Informazione, Seconda Università degli Studi di Napoli, Viale Beneduce 10, Via Roma 29, 81031 Aversa, Italy

Guest Editors

  • Yogesh Jaluria, School of Engineering, Rutgers, The State University of New Jersey, 98 Brett Road, Piscataway, NJ 08854-8058, USA
  • Guy Lauriat, Laboratoire de Modélisation et Simulation Multi Echelle, UMR 8208 CNRS, Université Paris-Est Marne-la-Vallée, Bâtiment Lavoisier, 5 boulevard Descartes, 7454 Marne-La-Vallée Cedex 2, France
  • Kambiz Vafai, Department of Mechanical Engineering, University of California, Riverside, A363 Bourns Hall, Riverside, CA 92521-0425, USA
  • Liqiu Wang, Department of Mechanical Engineering, The University of Hong Kong, Pokfulam Road, Hong Kong