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Advances in Multiscale Modeling and Computational Mechanics

Call for Papers

Multiscale modeling is one of the most popular research fields in material science and mechanical engineering, which can generally be grouped into microscopic, mesoscopic, and macroscopic regimes. The microscopic scale corresponds to atomistic level involving methods of density functional theory, first-principles molecular dynamics, and quantum Monte Carlo. Mesoscopic scale is characteristic of a large number of particles that interact with a quantum-mechanically correlated fashion. Macroscopic scale focuses on highest level length measurements of objects and corresponds to continuum mechanics. Considering the complex behaviors such as fracture and heat transfer in heterogeneous materials, one now needs to develop computational tools to integrate models from microscales to macroscales.

Multiscale simulations are becoming increasingly important for designing materials and predicting performance for applications in advanced engineering. Computational mechanics seeks to develop new methods for computer-aided prediction of physical phenomena that are of engineering importance. The aim of the special issueis to present recent research developments in these fields. The issue will address the general theme of multiscale modeling and computational mechanics; that is, studies on quantum mechanics, molecular mechanics, discrete defect dynamics, phase field modeling, and continuum mechanics for materials and structures are welcome. We invite investigators to contribute original research articles as well as review articles to this special issue. Potential topics include, but are not limited to:

  • Cohesive finite-element method (CFEM) in analyzing microscale failure
  • Designing electrode materials by quantum mechanics and/or molecular mechanics
  • Interface and adhesion at micro/nano/bridging scale
  • Heat transfer, localization, and failure in heterogeneous materials
  • Microstructures with complex interfaces
  • Homogenization and length-scale bridging methods
  • Micromechanics and reliability of microelectronic packages

Before submission, authors should carefully read over the journal’s Author Guidelines, which are located at http://www.hindawi.com/journals/ame/guidelines/. Prospective authors should submit an electronic copy of their complete manuscript through the journal Manuscript Tracking System at http://mts.hindawi.com/submit/journals/ame/multis/ according to the following timetable:

Manuscript DueFriday, 25 April 2014
First Round of ReviewsFriday, 18 July 2014
Publication DateFriday, 12 September 2014

Lead Guest Editor

  • Ningbo Liao, College of Mechanical and Electrical Engineering, Wenzhou University, Wenzhou 325035, China

Guest Editors

  • Ping Yang, Laboratory of Materials 8 Micro-Structural Integrity, Jiangsu University, Zhenjiang 212013, China
  • Kristina Nilsson, Department of Mechanical Engineering, Faculty of Engineering, Lund University, P.O. Box 118, 221 00 Lund, Sweden
  • Bin Xu, Institut de Physique, Université de Liège, Allée du 6 Août, 17, Sart Tilman 4000 Liège, Belgium