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Digital Manufacturing and Cloud Manufacturing

Call for Papers

To survive and be successful despite global market turbulence and increasing competition, manufacturing enterprises need to extend their vision to cover interrelated areas, such as sustainable value creation, flexible and agile business processes, rapid production responsiveness, and dependability performance. In this context, the new manufacturing models, Digital Manufacturing and Cloud Manufacturing, have emerged, in order to help manufacturing enterprises to tackle the above challenges. Both Digital Manufacturing and Cloud Manufacturing aim at improving enterprises being integrated, digital, intelligent, agile, networked, green, and service-oriented, and also achieving the goal of sustainable development. Digital Manufacturing is the basis of Cloud Manufacturing, while Cloud Manufacturing is the developing trend of Digital Manufacturing.

This special issue focuses on the latest advancements in Digital Manufacturing and Cloud Manufacturing. We invite investigators to contribute to this special issue with original research articles and review articles on theories and key technologies for Digital Manufacturing and Cloud Manufacturing, as well as their applications to conquer engineering problems. Potential topics include, but are not limited to:

  • Architectures, business models, strategies, and standards for Digital Manufacturing and Cloud Manufacturing
  • Service-Oriented and computing-Based manufacturing systems
  • Artificial intelligence, Swarm-Based optimization, and Knowledge-Based management in manufacturing processes
  • Complex/dynamic characteristics and networked control for manufacturing systems
  • Digital monitoring and fault diagnosis for manufacturing systems
  • Green manufacturing, remanufacturing, and sustainable manufacturing strategies
  • Trust, security, and privacy issues in manufacturing information systems

Before submission authors should carefully read over the journal's Author Guidelines, which are located at http://www.hindawi.com/journals/ame/guidelines/. Prospective authors should submit an electronic copy of their complete manuscript through the journal Manuscript Tracking System at http://mts.hindawi.com/submit/journals/ame/dmcm/ according to the following timetable:

Manuscript DueFriday, 15 March 2013
First Round of ReviewsFriday, 7 June 2013
Publication DateFriday, 2 August 2013

Lead Guest Editor

  • Zude Zhou, School of Mechanical and Electronic Engineering, Wuhan University of Technology, Wuhan 430070, China

Guest Editors

  • Jerry Fuh, Department of Mechanical Engineering, National University of Singapore (NUS), 9 Engineering Drive 1, Singapore 117576
  • Shane Xie, Department of Mechanical Engineering, The University of Auckland, Private Bag 92019, Auckland, New Zealand
  • Zhongwei Jiang, Department of Mechanical Engineering, Yamaguchi University, Yamaguchi, Ube 755-8611, Japan