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Mechatronics and Mechanical Engineering in Cyber-Physical Systems

Call for Papers

Cyber-physical systems (CPSs) are physical and engineered systems whose operations are monitored, coordinated, controlled, and integrated by a computing and communication core. This intimate coupling between the cyber and physical will be manifested from the nanoworld to large-scale wide-area systems of systems. CPS will transform how we interact with the physical world just like the Internet transformed how we interact with one another. Mechatronics and mechanical engineering play important roles in building CPS and developing real-life CPS applications. How to apply methods and tools emerging from mechatronics and mechanical engineering to CPS is still an open issue to us.

This special issue focuses on the latest advancements in mechatronics and mechanical engineering towards CPS. We invite scientists and investigators to contribute to this special issue with original research articles and review articles on theories and key technologies for mechatronics and mechanical engineering in CPS, as well as their applications to conquer engineering problems. Potential topics include, but are not limited to:

  • Automation and intelligent control in CPS
  • MEMS in CPS
  • AI techniques in CPS
  • Mechatronics methods for CPS
  • CPS applications in manufacturing
  • Optimization of CPS
  • Modeling of processes in CPS
  • Robotics
  • Applied mechanics for CPS
  • Biomechanics
  • Sensors and sensor networks
  • Other related topics

Before submission authors should carefully read over the journal’s Author Guidelines, which are located at http://www.hindawi.com/journals/ame/guidelines/. Prospective authors should submit an electronic copy of their complete manuscript through the journal Manuscript Tracking System at http://mts.hindawi.com/submit/journals/ame/mesp/ according to the following timetable:

Manuscript DueFriday, 6 December 2013
First Round of ReviewsFriday, 28 February 2014
Publication DateFriday, 25 April 2014

Lead Guest Editor

Guest Editors

  • Hongyuan Jiang, Harbin Institute of Technology, Harbin, Heilongjiang, China
  • Quan Quan, Beijing University of Aeronautics and Astronautics, Beijing, China
  • Algimantas Fedaravicius, Kaunas University of Technology, Kaunas, Lithuania
  • Gongnan Xie, Northwestern Polytechnical University, Xi’an, Shaanxi, China