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Advances in Materials Science and Engineering
Volume 2012 (2012), Article ID 520967, 5 pages
doi:10.1155/2012/520967
Integral Solution of the Interface Profile of Grain Boundary Grooving by Surface Diffusion
1Department of Mathematics, Shanghai Maritime University, Shanghai 201306, China
2Shaanxi Key Laboratory for Condensed Matter Structure and Properties, Northwestern Polytechnical University, Xi'an 710072, China
3Department of Mathematics, Shanghai University, Shanghai 200444, China
Received 23 June 2012; Revised 14 October 2012; Accepted 15 October 2012
Academic Editor: Pavel Lejcek
Copyright © 2012 Caifang Wang et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
How to Cite this Article
Caifang Wang, Hui Xing, Fengping Yao, Changle Chen, Jianyuan Wang, and Fei Fan, “Integral Solution of the Interface Profile of Grain Boundary Grooving by Surface Diffusion,” Advances in Materials Science and Engineering, vol. 2012, Article ID 520967, 5 pages, 2012. doi:10.1155/2012/520967