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Advances in Materials Science and Engineering
Volume 2013 (2013), Article ID 123697, 11 pages
http://dx.doi.org/10.1155/2013/123697
Review Article

Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, 14300 Nibong Tebal, Penang, Malaysia

Received 9 October 2012; Revised 18 January 2013; Accepted 4 February 2013

Academic Editor: J. Paulo Davim

Copyright © 2013 Liu Mei Lee and Ahmad Azmin Mohamad. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.