About this Journal Submit a Manuscript Table of Contents
Advances in Materials Science and Engineering
Volume 2013 (2013), Article ID 123697, 11 pages
http://dx.doi.org/10.1155/2013/123697
Review Article

Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, 14300 Nibong Tebal, Penang, Malaysia

Received 9 October 2012; Revised 18 January 2013; Accepted 4 February 2013

Academic Editor: J. Paulo Davim

Copyright © 2013 Liu Mei Lee and Ahmad Azmin Mohamad. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Citations to this Article [3 citations]

The following is the list of published articles that have cited the current article.

  • Muhammad Ghaddafy Affendy, and Ahmad Azmin Mohamad, “Effects of Crosshead Speeds on Solder Strength of Cu/Sn-9Zn/Cu Lap Joints,” Journal of King Saud University - Engineering Sciences, 2013. View at Publisher · View at Google Scholar
  • Muhammad Firdaus Mohd Nazeri, Ahmad Badri Ismail, and Ahmad Azmin Mohamad, “Effect of polarizations on Sn-Zn solders alloys in alkaline electrolyte,” Journal of Alloys and Compounds, vol. 606, pp. 278–287, 2014. View at Publisher · View at Google Scholar
  • Liang Zhang, and K. N. Tu, “Structure and properties of lead-free solders bearing micro and nano particles,” Materials Science & Engineering R-Reports, vol. 82, pp. 1–32, 2014. View at Publisher · View at Google Scholar