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Advances in Materials Science and Engineering
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2013
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Article
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Fig 12
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Review Article
Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review
Figure 12
(a) Cu
3
Sn and (b) Cu
6
Sn
5
IMCs thickness as a function of reflow temperature at a reflow time of 30 s.
(a)
(b)