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Advances in Materials Science and Engineering
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2013
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Article
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Fig 4
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Review Article
Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review
Figure 4
XRD patterns from the top surface of (a) SAC305 solder wire, (b) as-deposited SAC305 thin film, and (c) as-reflowed SAC305/Cu.