Advances in Materials Science and Engineering

Review Article

Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

Figure 6

Morphologies of Ag3Sn compound at varying Ag concentrations with (a) 1.0 Ag to 3.0 Ag alloying and (b) 4.0 Ag alloying.
123697.fig.006a
(a)
123697.fig.006b
(b)