Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

<table> Schematic diagram of IMCs thickness measurements, with <svg height="16.3125" id="M26" style="vertical-align:-3.27605pt" version="1.1" viewbox="0 0 15.8875 16.3125" width="15.8875" xmlns="http://www.w3.org/2000/svg" xmlns:xlink="http://www.w3.org/1999/xlink">
<g transform="matrix(.017,-0,0,-.017,.062,12.162)"><path d="M530 686q-79 -330 -126 -595q-5 -24 4 -24q22 0 77 53l16 -24q-42 -49 -88 -78.5t-72 -29.5q-37 0 -19 83l21 99h-2q-62 -83 -153 -141q-65 -41 -97 -41q-28 0 -48 31.5t-20 91.5q0 71 32.5 144t88.5 118q36 30 94 52.5t94 22.5q38 0 68 -13l29 158q7 40 2 47.5t-38 7.5
h-35l1 26q39 4 76 13.5t58.5 17t27.5 7.5q16 0 9 -26zM387 375q-11 11 -38.5 20t-51.5 9q-45 0 -79 -23q-46 -32 -77.5 -107.5t-31.5 -143.5q0 -40 9.5 -58.5t23.5 -18.5q40 0 113.5 70t99.5 118z" id="x1D451"></path></g>
<g transform="matrix(.012,-0,0,-.012,9.5,16.25)"><path d="M384 0h-275v27q67 5 81.5 18.5t14.5 68.5v385q0 38 -7.5 47.5t-40.5 10.5l-48 2v24q85 15 178 52v-521q0 -55 14.5 -68.5t82.5 -18.5v-27z" id="x31"></path></g>
</svg> as the thickness of Cu<sub>6</sub>Sn<sub>5</sub> and <svg height="16.3125" id="M27" style="vertical-align:-3.27605pt" version="1.1" viewbox="0 0 15.8875 16.3125" width="15.8875" xmlns="http://www.w3.org/2000/svg" xmlns:xlink="http://www.w3.org/1999/xlink">
<g transform="matrix(.017,-0,0,-.017,.062,12.162)"><path d="M530 686q-79 -330 -126 -595q-5 -24 4 -24q22 0 77 53l16 -24q-42 -49 -88 -78.5t-72 -29.5q-37 0 -19 83l21 99h-2q-62 -83 -153 -141q-65 -41 -97 -41q-28 0 -48 31.5t-20 91.5q0 71 32.5 144t88.5 118q36 30 94 52.5t94 22.5q38 0 68 -13l29 158q7 40 2 47.5t-38 7.5
h-35l1 26q39 4 76 13.5t58.5 17t27.5 7.5q16 0 9 -26zM387 375q-11 11 -38.5 20t-51.5 9q-45 0 -79 -23q-46 -32 -77.5 -107.5t-31.5 -143.5q0 -40 9.5 -58.5t23.5 -18.5q40 0 113.5 70t99.5 118z" id="x1D451"></path></g>
<g transform="matrix(.012,-0,0,-.012,9.5,16.25)"><path d="M412 140l28 -9q0 -2 -35 -131h-373v23q112 112 161 170q59 70 92 127t33 115q0 63 -31 98t-86 35q-75 0 -137 -93l-22 20l57 81q55 59 135 59q69 0 118.5 -46.5t49.5 -122.5q0 -62 -29.5 -114t-102.5 -130l-141 -149h186q42 0 58.5 10.5t38.5 56.5z" id="x32"></path></g>
</svg> as the thickness of Cu<sub>3</sub>Sn.</table>

Advances in Materials Science and Engineering

fig9

Figure 9

Figure 9: Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review 