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Advances in Materials Science and Engineering
Volume 2013 (2013), Article ID 391267, 9 pages
http://dx.doi.org/10.1155/2013/391267
Research Article

Thermal and Cure Kinetics of Epoxy Molding Compounds Cured with Thermal Latency Accelerators

Department of Chemical and Materials Engineering, National University of Kaohsiung, No. 700, Kaohsiung University Road, Nan-Tzu District, Kaohsiung 811, Taiwan

Received 30 November 2012; Accepted 14 January 2013

Academic Editor: Roham Rafiee

Copyright © 2013 Chean-Cheng Su et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Chean-Cheng Su, Chien-Huan Wei, and Bo-Ching Li, “Thermal and Cure Kinetics of Epoxy Molding Compounds Cured with Thermal Latency Accelerators,” Advances in Materials Science and Engineering, vol. 2013, Article ID 391267, 9 pages, 2013. doi:10.1155/2013/391267