Journals
Publish with us
Publishing partnerships
About us
Blog
Advances in Materials Science and Engineering
Journal overview
For authors
For reviewers
For editors
Table of Contents
Special Issues
Advances in Materials Science and Engineering
/
2013
/
Article
/
Fig 1
/
Research Article
Thermal and Cure Kinetics of Epoxy Molding Compounds Cured with Thermal Latency Accelerators
Figure 1
Plots of the reaction rate versus time for TPP-BQ-cured EMCs at isothermal temperatures.
