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Advances in Materials Science and Engineering
Volume 2013 (2013), Article ID 391267, 9 pages
Thermal and Cure Kinetics of Epoxy Molding Compounds Cured with Thermal Latency Accelerators
Department of Chemical and Materials Engineering, National University of Kaohsiung, No. 700, Kaohsiung University Road, Nan-Tzu District, Kaohsiung 811, Taiwan
Received 30 November 2012; Accepted 14 January 2013
Academic Editor: Roham Rafiee
Copyright © 2013 Chean-Cheng Su et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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