Thermal and Cure Kinetics of Epoxy Molding Compounds Cured with Thermal Latency Accelerators

Table 1

Formulation of epoxy molding compounds.

Composition	Raw materials	Parts by weight
Epoxy	4,4′-diglycidyloxy-3,3′,5,5′-; tetramethyl biphenyl	90
Br-epoxy	Diglycidyl ether of brominated bisphenol A	10
Hardener	Phenol-aralkyl resin	88
Accelerator	Triphenylphosphine (TPP) or; triphenylphosphine-1,4-benzoquinone (TPP-BQ)	3
Filler	Fused silica	1510
Coupling agent	Glycidoxypropyltrimethoxysilane	7
Release agent	Ethyleneglycol ester of montanic acid	7
Colorant	Carbon black	4