Table 1: Formulation of epoxy molding compounds.

Composition Raw materials Parts by weight Epoxy 4,4′-diglycidyloxy-3,3′,5,5′- tetramethyl biphenyl 90 Br-epoxy Diglycidyl ether of brominated bisphenol A 10 Hardener Phenol-aralkyl resin 88 Accelerator Triphenylphosphine (TPP) or triphenylphosphine-1,4-benzoquinone (TPP-BQ) 3 Filler Fused silica 1510 Coupling agent Glycidoxypropyltrimethoxysilane 7 Release agent Ethyleneglycol ester of montanic acid 7 Colorant Carbon black 4