Table 1: Formulation of epoxy molding compounds.

CompositionRaw materials Parts by weight

Epoxy4,4′-diglycidyloxy-3,3′,5,5′-
tetramethyl biphenyl
90
Br-epoxyDiglycidyl ether of brominated bisphenol A10
HardenerPhenol-aralkyl resin88
AcceleratorTriphenylphosphine (TPP) or
triphenylphosphine-1,4-benzoquinone (TPP-BQ)
3
Filler Fused silica1510
Coupling agentGlycidoxypropyltrimethoxysilane7
Release agentEthyleneglycol ester of montanic acid7
Colorant Carbon black4