Thermal and Cure Kinetics of Epoxy Molding Compounds Cured with Thermal Latency Accelerators

Table 2

Heats of reaction of epoxy molding compounds catalyst by TPP and TPP-BQ.

Accelerators	𝑇 (°C)	Δ𝐻Io (J g^−1)	Δ𝐻𝑅 (J g^−1)	Δ𝐻𝑇 (J g^−1)	𝛼I (%)
	130	170	12	182	93.4
	150	184	0	184	100
TPP-BQ	165	183	0	183	100
	175	185	0	185	100
	185	186	0	186	100
	130	171	13	184	92.9
	150	183	0	183	100
TPP	165	184	0	184	100
	175	183	0	183	100
	185	185	0	185	100