Table 2: Analysis of the component of copper surface in operation.

Concentration of nanofluidDispersant addedSurface distributionComponent analysis

0.5 wt.% Al2O3/waterNo dispersant added686409.tab.001686409.tab.002
0.05 wt.% cationic chitosan dispersant added686409.tab.003686409.tab.004

1.0 wt.% Al2O3/waterNo dispersant added686409.tab.005686409.tab.006
0.05 wt.% cationic chitosan dispersant added686409.tab.007686409.tab.008