Comparison of H<sub><b>2</b></sub> and NH<sub><b>3</b></sub> Treatments for Copper Interconnects

<table>Sheet resistance of Cu lines and leakage current between Cu lines after various plasma treatment conditions.</table>

Advances in Materials Science and Engineering

Figure 10: Comparison of H<sub><b>2</b></sub> and NH<sub><b>3</b></sub> Treatments for Copper Interconnects 