Comparison of H<sub><b>2</b></sub> and NH<sub><b>3</b></sub> Treatments for Copper Interconnects

<table>Cu EM failure time distribution for various plasma treatment conditions.</table>

Advances in Materials Science and Engineering

Figure 11: Comparison of H<sub><b>2</b></sub> and NH<sub><b>3</b></sub> Treatments for Copper Interconnects 