Advances in Materials Science and Engineering

Research Article

Integrating the TRIZ and Taguchi's Method in the Optimization of Processes Parameters for SMT

Table 1

Correlation table between factors influencing the uneven thickness of solder paste and 39 technical parameters.
Technical parametersInfluence factors
12345678910111213
Work temperatureWork humiditySolder paste typeSolder paste proportionSqueegee angleSqueegee pressureSqueegee speedEjection speedSolder paste poiseStencil tensitySqueegee stencil thicknessPCB flatnessWorking platform flatness
1             
2             
3           
4            
5          
6       
7             
8             
9          
10             
11       
12    
13    
14      
15             
16             
17             
18             
19             
20             
21             
22             
23             
24             
25          
26       
27
28        
29             
30             
31             
32             
33             
34             
35             
36            
37            
38            
39            
Number of correlations426712131112109797
Ranking1213118214256868