Crack Detection in Single-Crystalline Silicon Wafer Using Laser Generated Lamb Wave

Table 2

Properties of the wafer.

Properties	Value						Unit
Reflectivity	0.32
Density	2330						kg/m^3
Coefficient of thermal expansion	2.6×10^−6						1/K
Thermal conductivity	130						W/(m·K)
Heat capacity at constant pressure	700						J/(kg·K)
Elasticity matrix	166	64	64	0	0	0	GPa
	64	166	64	0	0	0
	64	64	166	0	0	0
	0	0	0	80	0	0
	0	0	0	0	80	0
	0	0	0	0	0	80