Research Article

Numerical Simulation Procedure for Modeling TGO Crack Propagation and TGO Growth in Thermal Barrier Coatings upon Thermal-Mechanical Cycling

Table 1

Material properties for TGO and metal substrate.

Material propertyTGOMetal substrate

Young’s modulus (GPa)390140
Poisson’s ratio0.20.3
CTE (ppm/°C)8.314.3
Creep exponent, 2.02.5
Creep prefactor,
Yielding stress, At dwell time:  MPa
At cooling and heating: assumed to be elastic
°C,  MPa
°C,  MPa
vary linearly in between