Synthesis and Characterization of SiO₂ Nanoparticles and Their Efficacy in Chemical Mechanical Polishing Steel Substrate

Table 2

CMP test conditions.

Down force (N)	20
Down pressure (N/cm^2)	0.52
Table speed (rpm)	200
Polishing time (min)	20
Slurry flow rate (mL/min)	100